 To allow for greater power and heat dissipation, REDI includes provision for increased board-to-board spacing and increased board thickness.A number of manufacturers have announced products based on the VPX standard, in both 3U and 6U form factors.These include single-board computers (based on both Intel and PowerPC architectures), multiprocessors, graphics processors, FPGA-based processing modules, mass storage, switches, and complete integrated subsystems.