 The eDRAM (embedded DRAM) memory was manufactured by Toshiba in a 3D system-in-package chip with two integrated circuit (IC) dies stacked vertically.Toshiba called it "semi-embedded DRAM" at the time, before later calling it a stacked "chip-on-chip" (CoC) solution.The 166 MHz graphics chip has 2 MiB embedded memory and through its 512 bit interface provides hardware polygon and NURBS rendering, 16bit Depth Buffer, Bézier Surfaces, Bézier Curves, B-Splines, hardware directional per-vertex lighting, Bloom, Motion Blur, Gouraud Shading, Cel Shading, culling, mipmapping, LOD, clipping, Lightmapping, environment mapping, Render to Texture, shadow mapping, shadow volumes, environment projection and perspective-correct texture mapping, texture compression, tessellation, Hardware Transform and Lighting (T&L), fogging, alpha blending, alpha, depth and stencil tests, transparency effects, post-processing effects, vertex blending for morphing effects, and dithering, all in 16 or 24 bit color.