 It eliminated the labor-intensive wire-bonding process used for integrated circuits at the time and allowed automated assembly of semiconductor chips onto larger substrates to produce hybrid integrated circuits.In the early 1960s, M.P.Lepselter developed the techniques for fabricating a structure consisting of electroforming an array of thick, self-supporting gold patterns on a thin film Ti-Pt Au base, hence the name "beams", deposited on the surface of a silicon wafer.