 The benefit to the DBG process is higher die strength.Alternatively, plasma dicing may be used, which replaces the dicer's saw with DRIE plasma etching.The DBG process requires a back grinding tape that has the following attributes, 1) strong adhesive force (Prevents infiltration of grinding fluid and die dust during grinding), 2) absorption and/or relief of compression stress and shear stress during grinding, 3) suppresses cracking due to contact between dies, 4) adhesive strength that can be greatly reduced through UV irradiation.