 Each will be packaged in a suitable package or placed directly on a printed circuit board substrate as a "bare die".The areas that have been cut away, called "die streets", are typically about 75 micrometres (0.003 inch) wide.Once a wafer has been diced, the die will stay on the dicing tape until they are extracted by die-handling equipment, such as a "die bonder" or "die sorter", further in the electronics assembly process.