 It is important to use solder compatible with both the PCB and the parts used.An example is ball grid array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste.Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel).