)can be integrated on the same substrate with integrated passives specifically if the substrate is silicon or some other semiconductor like gallium arsenide (GaAs).Integrated passive devices can be packaged, bare dies/chips or even stacked (assembled on top of some other bare die/chip) in a third dimension (3D) with active integrated circuits or other IPDs in an electronic system assembly.Typical packages for integrated passives are SIL (Standard In Line), SIP or any other packages (like DIL, DIP, QFN, chip-scale package, wafer level package etc.)