 The substrate can be also flexible like laminate e. g. a package interposer (called as an active interposers), FR4 or similar, Kapton or any other suitable polyimide.It is beneficial for the electronics system design if the effect of the substrate and the possible package to the performance of IPDs can be neglected or known.Manufacturing of IPDs used include thick and thin film technologies and variety of integrated circuit processing steps or modifications (like thicker or different metals than aluminum or copper) of them.