 In 2012, Vaughey, et al., reported a new all-inorganic electrode structure based on electrochemically active silicon particles bound to a copper substrate by a Cu3Si intermetallic.Copper nanoparticles were deposited on silicon particles articles, dried, and laminated onto a copper foil.After annealing, the copper nanoparticles annealed to each other and to the copper current collector to produce a porous electrode with a copper binder once the initial polymeric binder burned out.