 3D integrated circuit (3D IC) technology stacks integrated circuit (IC) chips vertically into a single 3D IC chip package.Toshiba introduced 3D IC technology to NAND flash memory in April 2007, when they debuted a 16GB THGAM embedded NAND flash memory chip, which was manufactured with eight stacked 2GB NAND flash chips.In September 2007, Hynix Semiconductor (now SK Hynix) introduced 24-layer 3D IC technology, with a 16GB flash memory chip that was manufactured with 24 stacked NAND flash chips using a wafer bonding process.