 Toshiba also used an eight-layer 3D IC for their 32GB THGBM flash chip in 2008.In 2010, Toshiba used a 16-layer 3D IC for their 128GB THGBM2 flash chip, which was manufactured with 16 stacked 8GB chips.In the 2010s, 3D ICs came into widespread commercial use for NAND flash memory in mobile devices.