 For example, the specifications directed capture to be qualified “...by analysis under dynamic loads imposed by the SRMS and SSRMS...validated by assembly-level test that includes variation of performance resulting from temperature and pressure on the ACBM and PCBM and on their interfacing structures.” Boltup analyses of the ACBM/PCBM interface, and subsequent leakage, required similar validation by element- and assembly-level tests that included the distorting effects of pressure and temperature.End-to-end demonstrations were also required at the assembly level to verify "...mechanical functionality...without interruption from accomplishment of ready-to-latch indication and capture.