 An isolated CNT can carry current
densities in excess of 1000 MA/cm2 without damage even at an elevated temperature of , eliminating electromigration reliability concerns that plague Cu interconnects.Recent modeling work comparing the two has shown that CNT bundle interconnects can potentially offer advantages over copper.Recent experiments demonstrated resistances as low as 20 Ohms using different architectures, detailed conductance measurements over a wide temperature range were shown to agree with theory for a strongly disordered quasi-one-dimensional conductor.