34f08f34_rials_patent_application_class__Description
20130008625 01-10-2013 [Description] 
BINDER COMPOSITION FOR USE IN MOLD MANUFACTURING - The present invention provides a binder composition for use in mold manufacturing that is capable of preventing a deterioration in the mold strength in a high-humidity environment, and further restraining the generation of an irritant gas at the time of casting; and a mold manufacturing composition wherein this binder composition is used. In order to provide such the binder composition, the binder composition for use in mold manufacturing, comprises a furan resin, and a metal compound containing one or more metal elements selected from the group consisting of elements in the Groups 2, 4, 7, 10, 11 and 13 of the periodic table, wherein the content by percentage of the metal element(s) in the binder composition is from 0.01 to 0.70% by weight, and the metal compound is one or more metal compounds selected from hydroxides, nitrates, oxides, organic acid salts, alkoxides, and ketone complexes.
Utilizing particular mold materials patent application class