870a94c6_carbon_nanotubes___Patents_com__Description
[Patent #] US-8,048,283 [Description] 
Method and apparatus for plating semiconductor wafers First and second electrodes are disposed at first and second locations, respectively, proximate to a periphery of a wafer support, wherein the first and second...
Patents filed at Nov 01 2011 | Method for manufacturing thermal interface material having carbon nanotubes | Patents.com