f138b376__City_KR___Patent_applications__Description
[Patent application number] 20100243628 [Published] 09-30-2010 [Description] 
SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME - A substrate cutting apparatus including: a stage to support a substrate; a laser generator to emit a laser beam; a beam oscillator to oscillate the laser beam onto a cutting line of the substrate, to heat the substrate; and a cooling unit to cool the heated substrate.
Jong-Heon Kim, Yongin-City KR - Patent applications