New RFID solution by Intel  Intel is continuing its push into
the mobile market by releasing a SoC which could mean lower 3G
implementation.  SMARTi UE2p is a new radio frequency product
that integrates 3G power amplifiers into radio frequency
circuits for a system-on-chip. It means that it is possible to
put 3G on a smaller footprint within the phone, making it easier
for developers of 3G-enabled devices and cuts the cost of
ownership. As far as Intel is concerned this means that it can
push its mobile hardware onto cheap and cheerful 3G phones which
are needed in developing economies.  SMARTi UE2p uses Intel’s 3G
high speed packet access (HSPA) radio frequency transceiver
SMARTi UE2 and 3G power amplifiers on a 65nm silicon die. It has
a direct connection to the device battery and supports multiple
3G dual band set-ups.  The move should allow mobile customers to
introduce lower-cost 3G handsets but also allow for the
development of connected objects. It is something that Intel has
been pushing as being part