From Integrated Circuit Packaging, Assembly and Interconnections
An anomaly that is in non-conformance with normally accepted
characteristics. The sharpness of a deposited pattern, or the
exactness with which a feature is patterned with respect to the
intended design. A debilitating change in a material
characteristic or a device performance. In packaging: Refers to
the number of components on a circuit or board or the amount of
conductor circuitry on a device package, a substrate or board. A
bare die (an element) or a packaged component. A condition that
results when molten solder has coated a surface and upon cooling
recedes leaving areas of uncovered base material. Plural of die.
An unpackaged semiconductor, e.g. a diode, transistor or an
integrated circuit, separated from a wafer. Also referred to as
a bare die or a chip. Bonding of semiconductor die to a
package/substrate. Same as die bonding. Adhesive attachment of a
semiconductor die to a package/substrate. Can be thermally
conductive or non-thermall