Until the mid-1990s, this type of flip-chip assembly was practiced almost exclusively by IBM and Delco. Around this time, Delco sought to commercialize its technology and formed Flip Chip Technologies with Kulicke & Soffa Industries as a partner. At the same time, MCNC (which had developed a plated version of IBM’s C4 process) received funding from DARPA to commercialize its technology. These two organizations, along with APTOS (Advanced Plating Technologies on Silicon), formed the nascent out-sourcing market.