One important application of the Marangoni effect is the use for drying silicon wafers after a wet processing step during the manufacture of integrated circuits. Liquid spots left on the wafer surface can cause oxidation that damages components on the wafer. To avoid spotting, an alcohol vapor (IPA) or other organic compound in gas, vapor, or aerosol form is blown through a nozzle over the wet wafer surface (or at the meniscus formed between the cleaning liquid and wafer as the wafer is lifted from an immersion bath), and the subsequent Marangoni effect causes a surface-tension gradient in the liquid allowing gravity to more easily pull the liquid completely off the wafer surface, effectively leaving a dry wafer surface.