Dielectric thermal analysis (DETA), or dielectric analysis (DEA), is a materials science technique similar to dynamic mechanical analysis except that an oscillating electrical field is used instead of a mechanical force. For investigation of the curing behavior of thermosetting resin systems, composite materials, adhesives and paints, Dielectric Analysis (DEA) can be used in accordance with ASTM E 2038 or E 2039. The great advantage of DEA is that it can be employed not only on a laboratory scale, but also in process.