Hardmask materials can be metal or dielectric. Silicon based masks such as silicon dioxide or silicon carbide are usually used for etching low-κ dielectrics. However, SiOCH (carbon doped hydrogenated silicon oxide), a material used to insulate copper interconnects, requires an etchant that attacks silicon compounds. For this material, metal or amorphous carbon hardmasks are used. The most common metal for hardmasks is titanium nitride, but tantalum nitride has also been used.