Thermal bumps can be evenly distributed across the surface of a chip to provide a uniform cooling effect. In this case, the thermal bumps may be interspersed with standard bumps that are used for signal, power and ground. This allows the thermal bumps to be placed directly under the active circuitry of the chip for maximum effectiveness. The number and density of thermal bumps are based on the heat load from the chip. Each P/N couple can provide a specific heat pumping (Q) at a specific temperature differential (ΔT) at a given electric current. Temperature sensors on the chip (“on board” sensors) can provide direct measurement of the thermal bump performance and provide feedback to the driver circuit.