In 2016, a team at Iowa State University proposed a method for "soldering without heat" by using encapsulated droplets of supercooled liquid metal to repair heat sensitive electronic devices. In 2019, the same team demonstrated the use of undercooled metal to print solid metallic interconnects on surfaces ranging from polar (paper and Jello) to superhydrophobic (rose petals), with all the surfaces being lower modulus than the metal.