One of the issues with the CSP type of package (which was intended to be soldered directly to an FR4 or flex circuit) was that for high-density interconnects, the soft solder bump provided less of a stand-off as the solder bump diameter and pitch were decreased. Different solutions were employed including one developed by Focus Interconnect Technology (former APTOS engineers), which used a high aspect ratio plated copper post to provide a larger fixed standoff than was possible for a soft solder collapse joint.