In microprocessors, graphics processors and other high-end chips, hotspots can occur as power densities vary significantly across a chip. These hotspots can severely limit the performance of the devices. Because of the small size of the thermal bumps and the relatively high density at which they can be placed on the active surface of the chip, these structures are ideally suited for cooling hotspots. In such a case, the distribution of the thermal bumps may not need to be even. Rather, the thermal bumps would be concentrated in the area of the hotspot while areas of lower heat density would have fewer thermal bumps per unit area. In this way, cooling from the thermal bumps is applied only where needed, thereby reducing the added power necessary to drive the cooling and reducing the general thermal overhead on the system.