Under thermal cycling stresses are generated in the solder due to coefficient of thermal expansion mismatch this causes the solder joints to experience non-recoverable deformation via creep and plasticity that accumulates and leads to degradation and eventual fracture.
This causes the solder joints to experience non-recoverable deformation via creep and plasticity that accumulates and leads to degradation and eventual fracture. Under thermal cycling, stresses are generated in the solder due to coefficient of thermal expansion mismatch.
Under thermal cycling, stresses are generated in the solder due to coefficient of thermal expansion mismatch. This causes the solder joints to experience non-recoverable deformation via creep and plasticity that accumulates and leads to degradation and eventual fracture.
Under thermal cycling, stresses are generated in the solder due to coefficient of thermal expansion mismatch. This causes the solder joints to experience non-recoverable deformation via creep and plasticity that accumulates and leads to degradation and eventual fracture.