Prior to grinding, wafers are commonly laminated with UV-curable back-grinding tape, which ensures against wafer surface damage during back-grinding and prevent wafer surface contamination caused by infiltration of grinding fluid and/or debris.
UV curable back grinding tapes ensure against wafer surface damage during back grinding and prevent wafer surface contamination caused by infiltration of grinding fluid and/or debris. Prior to grinding, wafers are commonly laminated with UV curable back grinding tape.
Prior to grinding, wafers are commonly laminated with UV curable back grinding tape. UV curable back grinding tapes ensure against wafer surface damage during back grinding and prevent wafer surface contamination caused by infiltration of grinding fluid and/or debris.
Prior to grinding, wafers are commonly laminated with UV curable back grinding tape. UV curable back grinding tapes ensure against wafer surface damage during back grinding and prevent wafer surface contamination caused by infiltration of grinding fluid and/or debris.