Aluminum can "creep", slowly deforming under load, eventually causing device connections to loosen, and also has a different coefficient of thermal expansion compared to the materials used for connections.
Aluminum also has a different coefficient of thermal expansion compared to the materials used for connections. Aluminum can "creep", slowly deforming under load, eventually causing device connections to loosen.
Aluminum can "creep", slowly deforming under load, eventually causing device connections to loosen. Aluminum also has a different coefficient of thermal expansion compared to the materials used for connections.
Aluminum can "creep", slowly deforming under load, eventually causing device connections to loosen. Aluminum also has a different coefficient of thermal expansion compared to the materials used for connections.