CVE:CVE-2019-19194
CNNVD:CNNVD-202002-659
Telink Semiconductor BLE SDK是中国泰凌微（Telink Semiconductor）公司的一款应用程序。
多款Telink Semiconductor产品中的BLE SDK的Bluetooth Low Energy Secure Manager Protocol(SMP)存在安全漏洞。攻击者可利用该漏洞对受保护的GATT服务数据进行任意读/写操作，导致设备崩溃，或可能控制设备的功能。以下产品及版本受到影响：Telink Semiconductor TLSR8258 BLE SDK 3.4.0及之前版本；Telink Semiconductor TLSR8269 BLE SDK 3.3及之前版本；Telink Semiconductor TLSR8253 BLE SDK 3.4.0及之前版本；Telink Semiconductor TLSR8251 BLE SDK 3.4.0及之前版本；Telink Semiconductor TLSR8232 BLE SDK 1.3.0及之前版本。
solution:Upgrade telink-semi tlsr8258_ble_sdk to a higher version than 3.4.0,and avoid the version (,3.4.0]; Upgrade telink-semi tlsr8269_ble_sdk to a higher version than 3.3,and avoid the version (,3.3]; Upgrade telink-semi tlsr8253_ble_sdk to a higher version than 3.4.0,and avoid the version (,3.4.0]; Upgrade telink-semi tlsr8251_ble_sdk to a higher version than 3.4.0,and avoid the version (,3.4.0]; Upgrade telink-semi tlsr8232_ble_sdk to a higher version than 1.3.0,and avoid the version (,1.3.0]