CVE:CVE-2022-22090
CNNVD:CNNVD-202206-495
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。
Qualcomm 多款产品存在资源管理错误漏洞，该漏洞源于在音频中管理来自内部缓存的缓冲区时出现释放后重用错误。本地攻击者利用该漏洞在目标系统上执行任意代码。
solution:Upgrade qualcomm sd_8_gen1_5g_firmware to a higher version than -; Upgrade qualcomm sd865_5g_firmware to a higher version than -; Upgrade qualcomm sd888_5g_firmware to a higher version than -; Upgrade qualcomm sdx65_firmware to a higher version than -; Upgrade qualcomm sm7450_firmware to a higher version than -; Upgrade qualcomm sm8475_firmware to a higher version than -; Upgrade qualcomm sm8475p_firmware to a higher version than -; Upgrade qualcomm wcd9370_firmware to a higher version than -; Upgrade qualcomm wcd9375_firmware to a higher version than -; Upgrade qualcomm wcd9380_firmware to a higher version than -; Upgrade qualcomm wcd9385_firmware to a higher version than -; Upgrade qualcomm wcn6750_firmware to a higher version than -; Upgrade qualcomm wcn6850_firmware to a higher version than -; Upgrade qualcomm wcn6851_firmware to a higher version than -; Upgrade qualcomm wcn6855_firmware to a higher version than -; Upgrade qualcomm wcn6856_firmware to a higher version than -; Upgrade qualcomm wcn7850_firmware to a higher version than -; Upgrade qualcomm wcn7851_firmware to a higher version than -; Upgrade qualcomm wsa8810_firmware to a higher version than -; Upgrade qualcomm wsa8815_firmware to a higher version than -; Upgrade qualcomm wsa8830_firmware to a higher version than -; Upgrade qualcomm wsa8832_firmware to a higher version than -; Upgrade qualcomm wsa8835_firmware to a higher version than -