CVE:CVE-2022-33280
CNNVD:CNNVD-202302-850
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。
Qualcomm 芯片 Bluetooth 模块存在安全漏洞，该漏洞源于在处理 AVRCP 数据包时访问蓝牙主机中未初始化的指针而导致内存损坏。
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