CVE:CVE-2021-35070
CNNVD:CNNVD-202204-2501
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。
Qualcomm 多款产品存在信息泄露漏洞，该漏洞源于RPM安全流由于SMMU配置不当可以访问任何安全资源并可能导致信息泄露。以下产品和版本受到影响：QCM6125、QCS6125、SD665、WCD9370、WCD9375、WCN3950、WCN3980、WSA8810、WSA8815。
solution:Upgrade qualcomm qcm6125_firmware to a higher version than -; Upgrade qualcomm qcs6125_firmware to a higher version than -; Upgrade qualcomm sd665_firmware to a higher version than -; Upgrade qualcomm wcd9370_firmware to a higher version than -; Upgrade qualcomm wcd9375_firmware to a higher version than -; Upgrade qualcomm wcn3950_firmware to a higher version than -; Upgrade qualcomm wcn3980_firmware to a higher version than -; Upgrade qualcomm wsa8810_firmware to a higher version than -; Upgrade qualcomm wsa8815_firmware to a higher version than -