CVE:CVE-2023-21642
CNNVD:CNNVD-202305-063
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。
部分Qualcomm产品存在安全漏洞，该漏洞源于HAB内存管理中的访问控制不当，从而导致内存损坏。以下产品受到影响：QAM8295P, QCA6574AU, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SA8540P, SA9000P。
solution:Upgrade qualcomm qam8295p_firmware to a higher version than -; Upgrade qualcomm qca6574au_firmware to a higher version than -; Upgrade qualcomm qca6696_firmware to a higher version than -; Upgrade qualcomm sa6145p_firmware to a higher version than -; Upgrade qualcomm sa6150p_firmware to a higher version than -; Upgrade qualcomm sa6155p_firmware to a higher version than -; Upgrade qualcomm sa8145p_firmware to a higher version than -; Upgrade qualcomm sa8150p_firmware to a higher version than -; Upgrade qualcomm sa8155p_firmware to a higher version than -; Upgrade qualcomm sa8195p_firmware to a higher version than -; Upgrade qualcomm sa8295p_firmware to a higher version than -; Upgrade qualcomm sa8540p_firmware to a higher version than -; Upgrade qualcomm sa9000p_firmware to a higher version than -