CVE:CVE-2021-35108
CNNVD:CNNVD-202206-705
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。
Qualcomm多款产品存在代码问题漏洞，该漏洞源于在验证 Core 中的安全资源组权限时未正确检查 AP-S 锁定位。本地攻击者利用该漏洞可在系统上执行任意代码。
solution:Upgrade qualcomm sd_8_gen1_5g_firmware to a higher version than -; Upgrade qualcomm sm7450_firmware to a higher version than -; Upgrade qualcomm sm8475_firmware to a higher version than -; Upgrade qualcomm sm8475p_firmware to a higher version than -; Upgrade qualcomm wcd9370_firmware to a higher version than -; Upgrade qualcomm wcd9375_firmware to a higher version than -; Upgrade qualcomm wcd9380_firmware to a higher version than -; Upgrade qualcomm wcd9385_firmware to a higher version than -; Upgrade qualcomm wcn6750_firmware to a higher version than -; Upgrade qualcomm wcn6855_firmware to a higher version than -; Upgrade qualcomm wcn6856_firmware to a higher version than -; Upgrade qualcomm wcn7851_firmware to a higher version than -; Upgrade qualcomm wsa8830_firmware to a higher version than -; Upgrade qualcomm wsa8832_firmware to a higher version than -; Upgrade qualcomm wsa8835_firmware to a higher version than -