CVE:CVE-2021-35113
CNNVD:CNNVD-202206-715
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。
Qualcomm 多款产品存在数据伪造问题漏洞，该漏洞源于应用签名验证调用中的签名验证和散列顺序不正确。具有物理访问权限的攻击者可以绕过系统上的身份验证利用该漏洞破坏目标系统。
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