CVE:CVE-2022-40505
CNNVD:CNNVD-202305-064
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。
Qualcomm 芯片存在安全漏洞，该漏洞源于 Modem 模块存在缓冲区过度读取导致信息泄露。
solution:Upgrade qualcomm 9205_lte_modem_firmware to a higher version than -; Upgrade qualcomm 9206_lte_modem_firmware to a higher version than -; Upgrade qualcomm 9207_lte_modem_firmware to a higher version than -; Upgrade qualcomm mdm8207_firmware to a higher version than -; Upgrade qualcomm qca4004_firmware to a higher version than -; Upgrade qualcomm qca4010_firmware to a higher version than -; Upgrade qualcomm qts110_firmware to a higher version than -; Upgrade qualcomm snapdragon_1100_wearable_platform_firmware to a higher version than -; Upgrade qualcomm snapdragon_1200_wearable_platform_firmware to a higher version than -; Upgrade qualcomm snapdragon_wear_1300_platform_firmware to a higher version than -; Upgrade qualcomm snapdragon_x5_lte_modem_firmware to a higher version than -; Upgrade qualcomm wcd9306_firmware to a higher version than -; Upgrade qualcomm wcd9330_firmware to a higher version than -