The ultrasonic version of the process exploits the implosion of cavitation bubbles, which eliminate the need for a flux pretreatment by destroying the oxide film on the parts to be connected.
The ultrasonic version of the process exploits the implosion of cavitation bubbles, which eliminate the need for a flux pretreatment by destroying the oxide film on the parts to be connected. The wave method, used for printed circuit boards, floats the assembly on a molten metal alloy which later hardens into a uniform connective layer. FTP, identify this process of joining two metal surfaces without melting them, easily accomplished at home with the use of a hot iron.
The ultrasonic version of the process exploits the implosion of cavitation bubbles, which eliminate the need for a flux pretreatment by destroying the oxide film on the parts to be connected.
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