For ten points, identify this process in integrated circuit desi
A 2004 paper by Cong, Wei, and Zhang describes a thermal-driven method of doing this, and a paper in the same year by Adya and Markov describes the use of Paquet-1 to peform the  xed-outline type of this process. A 1993 paper bySarrafzadeh presents a method for converting an arbitrary result of this process into a sliceable one. Constraints on this process include the fact that IP blocks have a prede ned area and that bonding pads are usually located on the edges of   chips. For ten points, identify this process in integrated circuit desi
A 2004 paper by Cong, Wei, and Zhang describes a thermal-driven method of doing this, and a paper in the same year by Adya and Markov describes the use of Paquet-1 to peform the  xed-outline type of this process.
floorplanning [prompt on descriptive answers like  planning inte- grated circuit layouts]