The ultrasonic version of the process exploits the implosion of cavitation bubbles, which eliminate the need for a flux pretreatment by destroying the oxide film on the parts to be connected. The wave method, used for printed circuit boards, floats the assembly on a molten metal alloy which later hardens into a uniform connective layer. FTP, identify this process of joining two metal surfaces without melting them, easily 
The ultrasonic version of the process exploits the implosion of cavitation bubbles, which eliminate the need for a flux pretreatment by destroying the oxide film on the parts to be connected. The wave method, used for printed circuit boards, floats the assembly on a molten metal alloy which later hardens into a uniform connective layer. FTP, identify this process of joining two metal surfaces without melting them, easily accomplished at home with the use of a hot iron.
The ultrasonic version of the process exploits the implosion of cavitation bubbles, which eliminate the need for a flux pretreatment by destroying the oxide film on the parts to be connected.
{solder}ing