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1.1.1 Types of Soldering Method


Soldering methods are broadly divided into two types: the partial heating method and the total heating method.

Partial heating method: Heat is applied to the package leads and/or PWB in a localized manner.

There are four types of soldering methods:

1. Soldering iron
2. Hot air
3. Laser
4. Pulse heating

Partial heating involves less heat stress on the device and printed wiring board, but is unsuitable for large volume production. Therefore, this method is mainly used to correct soldering or for devices with a low heat resistance.

Total heating method: Heat is applied to the entire package and/or PWB.

There are two types of soldering methods:

1. Infrared reflow
2. Convection reflow
3. Infrared convection combined
4. VPS (Vapor Phase Soldering)
5. Flow (wave) soldering

Because of excellence in productivity and running cost, these types are widely used. However, this method can place considerable heat stress on the semiconductor device and board.

Select the soldering method best suited to your application by taking into consideration the advantages and disadvantages of each soldering method, as well as the heat resistance of the SMD.

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