Automotive Industry

The speed that modern cars reach on highways demands quality and reliability at a level perhaps only exceeded by the aviation and military industries. The automotive industry however, operates at a vastly larger production scale, similar to that of the white-goods industry. Producing quality in quantity is tough, but Juscom has for many years met—and exceeded—the quality and quantity requirements of the Japanese and German car manufacturers and their other suppliers.


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When you have electronic control of mechanical devices, signal and power wiring eventually has to connect electronics in sealed boxes, to DC and AC machines exposed to harsh winter and summer conditions, and with constant vibration present.

There are only a few ways to achieve a waterproof seal at the boundary between the sealed and exposed environments. For example, you could use silicone or rubber seals. These materials however, can degrade quickly when exposed to automotive fluids, and cannot easily be moulded into complex shapes.

To solve the stringent sealing requirements in a car, we use specially formulated thermoplastic adhesives such as Henkel's Technomelt (formerly called Macromelt) and Bostik's Thermelt to form complex gaskets.

Encapsulation of PCBAs

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Printed circuit board assemblies (PCBAs) often need to be protected from fluids and vibration. Simply mounting the PCBA in a sealed box is not good enough since this would not be very vibration resistant. You could consider potting with epoxy compounds.

Epoxy potting works well in terms of protecting the encapsulated PCBA from fluids and vibration. The big problem with epoxy potting however, includes:
  1. Inability to create complex shapes;
  2. Long cure (and therefore processing) times;
  3. Rigid encapsulated forms;
  4. No possibility of rework.

For encapsulation of PCBAs, the best solution is to use low pressure, low viscosity overmoulding with thermoplastic adhesives. The low viscosity minimizes voids in the resulting project, and the low injection pressure greatly reduces the possibility of damage to the encapsulated components due to material infiltration.