There yet flowed and the residue of the

There are
many various difficulties in each of manual assembly and surface mount
technology within soldering. For manual assembly a variety of these problems
include disturbed joints which is when the solder moves as it’s solidifying.
Another problem that commonly occurs is a ‘cold joint’ where the solder has
been removed from the board too early and has not been allowed to melt
properly. Another frequent problem is an overheated joint, which is where the
surface mount technology these include, solder balls which are mainly caused by
poor process conditions which could include someone moving the board while the
solder is settling. Another is solder beads which can occur when the reflow
ramp up is either too fast or too slow. A further problem is bridging which can
occur both due to hot slumping and cold slumping. As well as this another common
problem is tombstoning which is most commonly caused by unequal components
placement on the board before reflow results in unbalanced solder forces.


Circuit boards are made up of extremely sensitive
components, and moving them about in a careless manner will almost certainly
cause the circuit board to break and no longer usable, especially putting
tension on the small components, static electricity damages boards completely so
the best way to prevent damage is to keep any sort of static electricity near
the board to a minimum and discharge any static charge that has been built up
in the circuit over time and hold the circuit board with care. While
transporting boards you should wear rubber soled shoes in order to ground
yourself before handling a board. When you are in control of circuit boards you
should make sure the humidity within your workspace is higher than normal as
static electricity builds up much more and much faster in low humidity and in

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paste is a material used in the creation of printed circuit boards to join surface


A pick and
place machine helps with the assembly of circuit boards by automating of whereof
small surfaces mount components on to boards, which then removes the process of
manually planning and soldering small components while using pick and place preparation
it has a vacuum and pump within the machine.


soldering is an operation which is dependent on contained heat to melt the
solder to lead to joints connecting, prior to this a solder paste is used to
attach multiple electrical components for a short time to their bond pads. Heating
joints with a hot air pencil. Reflow soldering is the most well-known method of
connecting surface mount components with a circuit board. The aim of the reflow
process is to melt the solder and heat the touching surfaces without
overheating and damaging the electrical components. There are 4 sections of
dwell temperature. The overall goal of the preheat section of the process is to
on the solder.


According to website ‘’
According to website ‘’ using a
new proprietary technology, magic cleaner 3D manages to remove particulates
the components used are becoming much smaller whilst the density of components


forming machines and lead forming tools performs both the same tasks lead
a wider range of axial and radical through hole components. There are many
different things that affect lead forming these include; the length of the lead
foot, the length of lead tip to lead tip, the thickness of the leads and the
length of the component body to the first bend in the lead, lead thickness is
the most important of the conditions.



soldering is a massive sprocess of soldering which is used in the making of
printed circuit boards. The circuit board is passed over molten solder in which
assemblies and surface mount. In the latter stage, the components are stuck
run through the hot liquid solder wave. As through hole parts have been mostly replaced
by surface mount components, wave soldering has been helped by reflow soldering
method in many large scale electronic applications. However, there is still a
lot of wave soldering where surface mount technology is not suitable.


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