

There's coolant in them thar channels

From Purdue earlier this month

Purdue University have developed a technology that uses “microjets” to deposit liquid into tiny channels and remove five times more heat than other experimental high-performance chip-cooling methods for computers and electronics.

The new technology, that uses hydrofluorocarbon in channels in the chips, can cool up to 1,000 watts of heat per square centimeter


This work has been funded by the U.S. Office of Naval Research. A similar concept, funded by IBM, uses water in 3D chip configurations.

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