July 18, 2006

other tech: top single crystal of semiconductor can be moved to other surfaces

A team led by electrical and computer engineer Zhenqiang (Jack) Ma and materials scientist Max Lagally have developed a process to remove a single-crystal film of semiconductor from the substrate on which it is built. This thin layer (only a couple of hundred nanometers thick) can be transferred to glass, plastic or other flexible materials, opening a wide range of possibilities for flexible electronics.



These are single-crystal films of strained silicon or silicon germanium. Strain is introduced in the way they form the membrane. Introducing strain changes the arrangement of atoms in the crystal such that they can achieve much faster device speed while consuming less power.



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