[Federal Register: March 4, 2009 (Volume 74, Number 41)]
[Notices]
[Page 9421-9422]
[DOCID:fr04mr09-57]

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DEPARTMENT OF HOMELAND SECURITY

Coast Guard

[USCG-2008-0929]

Collection of Information Under Review by Office of Management
and Budget: OMB Control Numbers: 1625-0040

AGENCY: Coast Guard, DHS.

ACTION: Thirty-day notice requesting comments.

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SUMMARY: In compliance with the Paperwork Reduction Act of 1995, this
request for comments announces that the U.S. Coast Guard is forwarding
an Information Collection Request (ICR), abstracted below, to the
Office of Information and Regulatory Affairs (OIRA), Office of
Management and Budget (OMB) requesting a revision of their approval for
the following collection of information: 1625-0040, Continuous
Discharge Book, Application, Physical Exam Report, Sea Service Report,
Chemical Testing, Entry Level Physical. Our ICR describes the
information we seek to collect from the public. Review and comments by
OIRA ensure we only impose paperwork burdens commensurate with our
performance of duties.

DATES: Please submit comments on or before April 3, 2009.

ADDRESSES: You may submit comments identified by Coast Guard docket
number [USCG-2008-0929] to the Docket Management Facility (DMF) at the
U.S. Department of Transportation (DOT) or to OIRA. To avoid
duplication, please submit your comments by only one of the following
means:
    (1) Electronic submission. (a) To Coast Guard docket at http://
www.regulation.gov. (b) To OIRA by e-mail via: oira_
<EMAIL_ADDRESS>    (2) Mail or Hand delivery. (a) DMF (M-30), DOT, West Building
Ground Floor, Room W12-140, 1200 New Jersey Avenue, SE., Washington, DC
20590-0001. Hand deliver between the hours of 9 a.m. and 5 p.m., Monday
through Friday, except Federal holidays. The telephone number is 202-
366-9329. (b) To OIRA, 725 17th Street, NW., Washington, DC 20503, to
the attention of the Desk Officer for the Coast Guard.
    (3) Fax. (a) To DMF,<PHONE_NUMBER>. (b) To OIRA at<PHONE_NUMBER>. To
ensure your comments are received in time, mark the fax to the
attention of the Desk Officer for the Coast Guard.
    The DMF maintains the public docket for this Notice. Comments and
material received from the public, as well as documents mentioned in
this Notice as being available in the docket, will become part of the
docket and will be available for inspection or copying at room W12-140
on the West Building Ground Floor, 1200 New Jersey Avenue, SE.,
Washington, DC, between 9 a.m. and 5 p.m., Monday through Friday,
except Federal holidays. You may also find the docket on the Internet
at  http://www.regulations.gov.
    A copy of the complete ICR is available through the docket on the
Internet at http://www.regulations.gov. Additionally, copies are
available from Commandant (CG-611), U.S. Coast Guard Headquarters
(Attn: Mr. Arthur Requina), 2100 2nd Street, SW., Washington, DC 20593-
0001. The telephone number is<PHONE_NUMBER>.

FOR FURTHER INFORMATION CONTACT: Mr. Arthur Requina, Office of
Information Management, telephone<PHONE_NUMBER> or fax<PHONE_NUMBER>, for
questions on these documents. Contact Ms. Renee V. Wright, Program
Manager, Docket Operations,<PHONE_NUMBER>, for questions on the docket.

SUPPLEMENTARY INFORMATION: The Coast Guard invites comments on whether
this ICR should be granted based on it being necessary for the proper
performance of Departmental functions. In particular, the Coast Guard
would appreciate comments addressing: (1) The practical utility of the
collections; (2) the accuracy of the estimated burden of the
collections; (3) ways to enhance the quality, utility, and clarity of
information subject to the collections; and (4) ways to minimize the
burden of collections on respondents, including the use of automated
collection techniques or other forms of information technology.
    Comments to Coast Guard or OIRA must contain the OMB Control Number
of the ICR. Comments to Coast Guard must contain the docket number of
this request, [USCG 2008-0929]. For your comments to OIRA to be
considered, it is best if they are received on or before April 3, 2009.
    Public participation and request for comments: We encourage you to
respond to this request by submitting comments and related materials.
We will post all comments received,

without change, to http://www.regulations.gov. They will include any
personal information you provide. We have an agreement with DOT to use
their DMF. Please see the paragraph on DOT's ``Privacy Act Policy''
below.
    Submitting comments: If you submit a comment, please include the
docket number [USCG-2008-0929], indicate the specific section of the
document to which each comment applies, providing a reason for each
comment. We recommend you include your name, mailing address, an e-mail
address, or other contact information in the body of your document so
that we can contact you if we have questions regarding your submission.
You may submit comments and material by electronic means, mail, fax, or
delivery to the DMF at the address under ADDRESSES; but please submit
them by only one means. If you submit them by mail or delivery, submit
them in an unbound format, no larger than 8\1/2\ by 11 inches, suitable
for copying and electronic filing. If you submit them by mail and would
like to know that they reached the Facility, please enclose a stamped,
self-addressed postcard or envelope. In response to your comments, we
may revise the ICR or decide not to seek an extension of approval for
this collection. The Coast Guard and OIRA will consider all comments
and material received during the comment period.
    Viewing comments and documents: Go to http://www.regulations.gov to
view documents mentioned in this Notice as being available in the
docket. Enter the docket number [USCG-2008-0929] in the Search box, and
click, ``Go>>.'' You may also visit the DMF in room W12-140 on the West
Building Ground Floor, 1200 New Jersey Avenue, SE., Washington, DC,
between 9 a.m. and 5 p.m., Monday through Friday, except Federal
holidays.
    Privacy Act: Anyone can search the electronic form of all comments
received in dockets by the name of the individual submitting the
comment (or signing the comment, if submitted on behalf of an
association, business, labor union, etc.). You may review a Privacy Act
Statement regarding our public dockets in the January 17, 2008 issue of
the Federal Register (73 FR 3316).

Previous Request for Comments

    This request provides a 30-day comment period required by OIRA. The
Coast Guard has published the 60-day notice (73 FR 54843, September 23,
2008) required by 44 U.S.C. 3506(c)(2), and a follow-up notice
reopening the comment period (73 FR 453, January 17, 2009). Neither
Notice elicited any comments.

Information Collection Request

    Title: Continuous Discharge Book, Application, Physical Exam
Report, Sea Service Report, Chemical Testing, Entry Level Physical.
    OMB Control Number: 1625-0040.
    Type of Request: Revision of a currently approved collection.
    Affected Public: Individuals and households.
    Abstract: Certain information is necessary for the Coast Guard to
determine issuance eligibility of merchant mariner credentials, i.e.,
license, certificate of registry, and merchant marine documents. Title
46 U.S.C. 7302(b) authorizes the Coast Guard to issue a Continuous
Discharge Book (CG Form 719A) upon request from an individual. Title 46
CFR 10.205(a), 10.207(a), 10.209(a)(1), 12.02-9(a), and 12.02-27(a)(1)
mandate that each applicant for a license, certificate of registry, or
merchant mariner document shall make written application on a Coast
Guard furnished form (CG Form 719B). Title 46 CFR 10.205(d), 12.05-5,
and 12.15-5 require each applicant requesting a license or merchant
mariner document to present a completed Coast Guard physical
examination report (CG Form 719K) executed by the physician. Title 46
CFR 10.207(e)(2) and 10.209(d)(2) state the report may be required.
Further, paragraph 10.211(a) mandates criteria (CG Form 719S) for
documenting sea service on vessels of less than 200 gross registered
tons. Title 46 CFR 10.202(i) and 12.02-9(f) mandates that each
applicant shall produce evidence (CG Form 719P) of having passed a
chemical test for dangerous drugs. Title 46 CFR 12.02-17(e) requires
entry-level merchant mariner document applicants to provide a statement
from a qualified practitioner attesting to the applicant's medical
fitness to perform the functions for which the document is issued (CG
Form 719K/E).
    Forms: CG-719A, CG-719B, CG-719K, CG-719K/E, CG-719S, CG-719P.
    Burden Estimate: The estimated burden has decreased from 329,356
hours to 10,833 hours a year.
    Authority: The Paperwork Reduction Act of 1995; 44 U.S.C. Chapter
35, as amended.

    Dated: February 25, 2009.
D.T. Glenn,
Rear Admiral, U.S. Coast Guard, Assistant Commandant for Command,
Control, Communications, Computers and Information Technology.
 [FR Doc. E9-4535 Filed 3-3-09; 8:45 am]

BILLING CODE 4910-15-P


[Federal Register: July 8, 2010 (Volume 75, Number 130)]
[Rules and Regulations]
[Page 39163-39165]
[DOCID:fr08jy10-14]

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DEPARTMENT OF HOMELAND SECURITY

Coast Guard

33 CFR Part 165

[Docket No. USCG-2010-0472]
RIN 1625-AA00

Safety Zone; Illinois River, Mile 119.7 to 120.3

AGENCY: Coast Guard, DHS.

ACTION: Temporary final rule.

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SUMMARY: The Coast Guard is establishing a temporary safety zone for

all waters of the Illinois River, Mile 119.7 to 120.3, extending the
entire width of the river. This safety zone is needed to protect
persons and vessels from safety hazards associated with a high speed
boat race occurring on a portion of the Illinois River. Entry into this
zone is prohibited unless specifically authorized by the Captain of the
Port Upper Mississippi River or a designated representative.

DATES: This rule is effective from 10 a.m. on July 17 until 7 p.m. on
July 18, 2010.

ADDRESSES: Documents indicated in this preamble as being available in
the docket are part of docket USCG-2010-0472 and are available online
by going to http://www.regulations.gov, inserting USCG-2010-0472 in the
``Keyword'' box, and then clicking ``Search.'' They are also available
for inspection or copying at the Docket Management Facility (M-30),
U.S. Department of Transportation, West Building Ground Floor, Room
W12-140, 1200 New Jersey Avenue, SE., Washington, DC 20590, between 9
a.m. and 5 p.m., Monday through Friday, except Federal holidays.

FOR FURTHER INFORMATION CONTACT: If you have questions on this
temporary rule, call or e-mail Lieutenant (LT) Rob McCaskey, Sector
Upper Mississippi River Response Department at telephone<PHONE_NUMBER>,
e-mail<EMAIL_ADDRESS>If you have questions on viewing the
docket, call Renee V. Wright, Program Manager, Docket Operations,
telephone<PHONE_NUMBER>.

SUPPLEMENTARY INFORMATION:

Regulatory Information

    The Coast Guard is issuing this temporary final rule without prior
notice and opportunity to comment pursuant to authority under section
4(a) of the Administrative Procedure Act (APA) (5 U.S.C. 553(b)). This
provision authorizes an agency to issue a rule without prior notice and
opportunity to comment when the agency for good cause finds that those
procedures are ``impracticable, unnecessary, or contrary to the public
interest.'' Under 5 U.S.C. 553(b)(B), the Coast Guard finds that good
cause exists for not publishing a notice of proposed rulemaking (NPRM)
with respect to this rule. Publication of an NPRM would be
impracticable because the event would occur before the rulemaking
process would be completed. Because of the dangers posed by the
pyrotechnics used in this fireworks display, the safety zone is
necessary to provide for the safety of event participants, spectators,
spectator craft, and other vessels transiting the event area. For the
safety concerns noted, it is in the public interest to have these
regulations in effect during the event.
    Under 5 U.S.C. 553(d)(3), the Coast Guard finds that good cause
exists for making this rule effective less than 30 days after
publication in the Federal Register. For the safety concerns noted, it
is in the public interest to have these regulations in effect during
the event, which will occur less than 30 days after the publication of
this rule.

Background and Purpose

    On July 17 & 18, 2010, the Havana Chamber of Commerce will be
conducting a high speed boat race between mile 119.7 and mile 120.3 on
the Illinois River. This event presents safety hazards to the
navigation of vessels between mile 119.7 and mile 120.3, extending the
entire width of the river. Because of the dangers posed by the
pyrotechnics used in this fireworks display, the safety zone is
necessary to provide for the safety of event participants, spectators,
spectator craft, and other vessels transiting the event area.

Discussion of Rule

    The Coast Guard is establishing a safety zone for all waters of the
Illinois River, Mile 119.7 to 120.3, extending the entire width of the
river. Entry into this zone is prohibited to all vessels and persons
except participants and those persons and vessels specifically
authorized by the Captain of the Port Upper Mississippi River. This
rule will be enforced from 10 a.m. until 7 p.m. CDT on July 17 & 18,
2010. The Captain of the Port Upper Mississippi River will inform the
public through local notice to mariners of all safety zone changes and
enforcement periods.

Regulatory Analyses

    We developed this rule after considering numerous statutes and
executive orders related to rulemaking. Below we summarize our analyses
based on 13 of these statutes or executive orders.

Regulatory Planning and Review

    This rule is not a ``significant regulatory action'' under section
3(f) of Executive Order 12866, Regulatory Planning and Review, and does
not require an assessment of potential costs and benefits under section
6(a)(3) of that Order. The Office of Management and Budget has not
reviewed it under that Order. This rule is not considered significant
because it will only be in effect for a limited time period.
Furthermore, advance notifications to the marine community will be made
through local notice to mariners and the River Industry Bulletin Board
(RIBB) at http://www.ribb.com.

Small Entities

    Under the Regulatory Flexibility Act (5 U.S.C. 601-612), we have
considered whether this rule would have a significant economic impact
on a substantial number of small entities. The term ``small entities''
comprises small businesses, not-for-profit organizations that are
independently owned and operated and are not dominant in their fields,
and governmental jurisdictions with populations of less than 50,000.
    The Coast Guard certifies under 5 U.S.C. 605(b) that this rule will
not have a significant economic impact on a substantial number of small
entities. This rule will affect the following entities, some of which
may be small entities: the owners or operators of vessels intending to
transit the Illinois River, Mile 119.7 to 120.3 after 10 a.m. until 7
p.m. CDT on July 17 & 18, 2010. This safety zone will not have a
significant economic impact on a substantial number of small entities
because this rule will only be in effect for a limited period of time.
    If you are a small business entity and are significantly affected
by this regulation, please contact LT Rob McCaskey, Sector Upper
Mississippi River at<PHONE_NUMBER>.

Assistance for Small Entities

    Under section 213(a) of the Small Business Regulatory Enforcement
Fairness Act of 1996 (Pub. L. 104-121), we offer to assist small
entities in understanding the rule so that they can better evaluate its
effects on them and participate in the rulemaking process.
    Small businesses may send comments on the actions of Federal
employees who enforce, or otherwise determine compliance with, Federal
regulations to the Small Business and Agriculture Regulatory
Enforcement Ombudsman and the Regional Small Business Regulatory
Fairness Boards. The Ombudsman evaluates these actions annually and
rates each agency's responsiveness to small businesses. If you wish to
comment on actions by employees of the Coast Guard, call 1-888-REG-FAIR
(1-888-734-3247). The Coast Guard will not retaliate against small
entities that question or complain about this rule or any policy or
action of the Coast Guard.

Collection of Information

    This rule calls for no new collection of information under the
Paperwork

Reduction Act of 1995 (44 U.S.C. 3501--3520).

Federalism

    A rule has implications for federalism under Executive Order 13132,
Federalism, if it has a substantial direct effect on State or local
governments and would either preempt State law or impose a substantial
direct cost of compliance on them. We have analyzed this rule under
that Order and have determined that it does not have implications for
federalism.

Unfunded Mandates Reform Act

    The Unfunded Mandates Reform Act of 1995 (2 U.S.C. 1531-1538)
requires Federal agencies to assess the effects of their discretionary
regulatory actions. In particular, the Act addresses actions that may
result in the expenditure by a State, local, or tribal government, in
the aggregate, or by the private sector of $100,000,000 (adjusted for
inflation) or more in any one year. Though this rule will not result in
such expenditure, we do discuss the effects of this rule elsewhere in
this preamble.

Taking of Private Property

    This rule will not cause a taking of private property or otherwise
have taking implications under Executive Order 12630, Governmental
Actions and Interference with Constitutionally Protected Property
Rights.

Civil Justice Reform

    This rule meets applicable standards in sections 3(a) and 3(b)(2)
of Executive Order 12988, Civil Justice Reform, to minimize litigation,
eliminate ambiguity, and reduce burden.

Protection of Children

    We have analyzed this rule under Executive Order 13045, Protection
of Children from Environmental Health Risks and Safety Risks. This rule
is not an economically significant rule and does not create an
environmental risk to health or risk to safety that may
disproportionately affect children.

Indian Tribal Governments

    This rule does not have tribal implications under Executive Order
13175, Consultation and Coordination with Indian Tribal Governments,
because it does not have a substantial direct effect on one or more
Indian tribes, on the relationship between the Federal Government and
Indian tribes, or on the distribution of power and responsibilities
between the Federal Government and Indian tribes.

Energy Effects

    We have analyzed this rule under Executive Order 13211, Actions
Concerning Regulations That Significantly Affect Energy Supply,
Distribution, or Use. We have determined that it is not a ``significant
energy action'' under that Order because it is not a ``significant
regulatory action'' under Executive Order 12866 and is not likely to
have a significant adverse effect on the supply, distribution, or use
of energy. The Administrator of the Office of Information and
Regulatory Affairs has not designated it as a significant energy
action. Therefore, it does not require a Statement of Energy Effects
under Executive Order 13211.

Technical Standards

    The National Technology Transfer and Advancement Act (NTTAA) (15
U.S.C. 272 note) directs agencies to use voluntary consensus standards
in their regulatory activities unless the agency provides Congress,
through the Office of Management and Budget, with an explanation of why
using these standards would be inconsistent with applicable law or
otherwise impractical. Voluntary consensus standards are technical
standards (e.g., specifications of materials, performance, design, or
operation; test methods; sampling procedures; and related management
systems practices) that are developed or adopted by voluntary consensus
standards bodies.
    This rule does not use technical standards. Therefore, we did not
consider the use of voluntary consensus standards.

Environment

    We have analyzed this rule under Commandant Instruction M16475.lD,
which guides the Coast Guard in complying with the National
Environmental Policy Act of 1969 (NEPA)(42 U.S.C. 4321-4370f), and have
concluded that this action is one of a category of actions that do not
individually or cumulatively have a significant effect on the human
environment. This rule is categorically excluded, under figure 2-1,
paragraph (34)(g), of the Instruction. This rule involves establishing,
disestablishing, or changing Regulated Navigation Areas and security or
safety zones. An environmental analysis checklist and a categorical
exclusion determination are available in the docket where indicated
under ADDRESSES.

List of Subjects in 33 CFR Part 165

    Harbors, Marine safety, Navigation (water), Reporting and
recordkeeping requirements, Security measures, Waterways.

0
For the reasons discussed in the preamble, the Coast Guard amends 33
CFR part 165 as follows:

PART 165--REGULATED NAVIGATION AREAS AND LIMITED ACCESS AREAS

0
1. The authority citation for part 165 continues to read as follows:

    Authority: 33 U.S.C. 1226, 1231; 46 U.S.C. Chapter 701, 3306,
3703; 50 U.S.C. 191, 195; 33 CFR 1.05-1(g), 6.04-1, 6.04-6, and
160.5; Pub. L. 107-295, 116 Stat. 2064; Department of Homeland
Security Delegation No. 0170.1.

0
2. Add Sec.  165.T08-0472 to read as follows:

Sec.  165.T08-0472  Safety Zone; Illinois River, Mile 119.7 to 120.3.

    (a) Location. The following area is a safety zone: all waters of
the Illinois River, Mile 119.7 to 120.3 extending the entire width of
the waterway.
    (b) Effective date. This rule is effective from 10 a.m. on July 17
until 7 p.m. on July 18, 2010.
    (c) Periods of Enforcement. This rule will be enforced from 10 a.m.
until 7 p.m. each day, on July 17 & 18, 2010. The Captain of the Port
Upper Mississippi River will inform the public through local notice to
mariners of all safety zone changes and enforcement periods.
    (d) Regulations. (1) In accordance with the general regulations in
Sec.  165.23 of this part, entry into this zone is prohibited unless
authorized by the Captain of the Port Upper Mississippi River or a
designated representative.
    (2) Persons or vessels requiring entry into or passage through the
zone must request permission from the Captain of the Port Upper
Mississippi River or a designated representative. The Captain of the
Port Upper Mississippi River representative may be contacted at (314)
269-2332.
    (3) All persons and vessels shall comply with the instructions of
the Captain of the Port Upper Mississippi River or their designated
representative. Designated Captain of the Port representatives include
United States Coast Guard commissioned, warrant, and petty officers of
the U.S. Coast Guard.

    Dated: June 18, 2010.
S. L. Hudson,
Captain, U.S. Coast Guard, Captain of the Port Upper Mississippi River.
[FR Doc. 2010-16586 Filed 7-7-10; 8:45 am]
BILLING CODE 9110-04-P


Equations I-24A and I-24B, which calculate the weighted average DREs for individual F-GHGs across process types, would rarely be used if the EPA adopts the same default DREs for all process types as proposed, because there will rarely be any need to calculate weighted average DREs across process types in that case. The sole exception may occur when a facility uses one or more abatement systems with a certified DRE value that is different from the default to calculate and report controlled emissions. To accommodate this situation and to simplify Equations I-24A and I-24B, we are proposing to modify Equations I-24A and I-24B to calculate the average DRE for each input gas "i" and by-product gas "k" based on tool counts and the same weighting factors that would be used in Equations I-24C and I-24D. This would eliminate the requirement to apportion gas consumption by process type when using the stack test method, even for those facilities that use abatement systems with different DREs for the same input gas "i" or by-product gas "k".

Requiring that all stacks be tested (if the stack test method is used) would remove not only the need to apportion gas usage to tested versus untested stacks, but also the requirement to perform a preliminary calculation of the emissions from each stack system. The EPA expects that the data received would be more accurate due to requiring testing of all stacks. Currently, to account for emissions from untested stacks, facilities must calculate gas consumption of each F-GHG used in tools that are vented from untested stacks by apportioning gas between untested and tested stacks. When abatement is used, facilities also currently need to apportion by process type. Apportioning gas requires using a fab-specific engineering model that must be based on a quantifiable metric, such as wafer passes or wafer starts, or direct measurement of input gas consumption and must be verified by demonstrating its precision and accuracy as described in 40 CFR 98.94(c)(1). As the number of stacks at each fab is expected to be small (e.g., one to two), the EPA expects that measuring all stacks would be more accurate and less burdensome than developing and verifying an apportioning model.
Gamma Weighting Factor
Using the stack testing method in Subpart I requires a lesser degree of gas use apportioning than the default emission factor method in 98.93(a). The proposed version of the stack testing method relies on counts of abated and unabated tools to estimate the fractions of input gases and by-products abated across multiple process types in equation 1-24C and I-24D. To accurately estimate these fractions, "gamma" weighting factors (Ɣi,p and Ɣk,i,p) are applied to these tool counts to account for the fact that emissions per tool can vary greatly across different process types. The gamma factors reflect the ratio of the pre-control emissions per tool of gas i or by-product k from tools running the weighted process type "p" (i.e., one of the chamber cleaning process subtypes) to the pre-control emissions per tool of gas i or by-product k from tools running the reference process type "q" (i.e., the etching process type). Weighting factors are particularly important when accounting for the fraction of input gases or by-products abated from plasma etching and wafer cleaning and chamber cleaning of thin-film deposition tools because input gas flow rates (and therefore emissions) for chamber cleaning tools can be significantly higher (by up to a factor 10 or more) than for etch tools, and because chamber cleaning and etch emission factors ((1-Ui), Bk,i) can also differ.

When developing the weighting factors, no distinction was made between in-situ plasma cleaning (IPC) and in-situ thermal cleaning (ITC) because the difference in flow rates between these two process types is usually relatively low and the available data submitted to the IPCC did not differentiate between the two process types. Gamma weighting factors have therefore been developed to weight counts of chamber cleaning tools compared to etch tools, but the same weighting factors are used for in-situ plasma chamber cleaning tools and for in-situ thermal chamber cleaning tools.  Separate weighting factors were developed for remote plasma cleaning (RPC) tools.

Equations I-24C and I-24 D in the proposed revisions to Subpart I are used to estimate the fraction of gas i and by-products k emitted from process tools that are equipped with suitable emissions control technologies. Such fractions (aif and akif) can be expressed as a function of (1) the pre-control emissions per tool and number of tools corresponding to chamber cleaning processes (IPC and/or ITC, and RPC) and (2) the pre-control emissions per tool and number of tools corresponding to etch and wafer cleaning processes, as shown below. (The pre-control emissions per tool, expressed as Ei,p/ni,p for chamber cleaning processes and as Ei,q/mi,q for etch and wafer cleaning processes, are assumed to be the same for all tools within that process type regardless of whether or not the tools are abated. That is, Ei,p/ni,p is assumed to equal Ei,p,a/ni,p,a and Ei,q/mi,q is assumed to equal Ei,q,a/mi,q,a.)

ai=pEi,p,a + Ei,q,ap Ei,p +Ei,q= pni,p,a  Ei,pni,p+  mi,q,a  Ei,qmi,qpni,p  Ei,pni,p+mi,q  Ei,qmi,q  	Eq. 4.2a
    Where:
ai = Estimate of the fraction of gas i exhausted from process tools equipped with abatement systems for gas i (site-specific fraction).
Ei,p,a = Pre-control emissions of gas i from tools running process type p using input gas i and that are equipped with abatement systems for gas i.
Ei,q,a = Pre-control Emissions of gas i from tools running process type q using input gas i and that are equipped with abatement systems for gas i.
Ei,p = Emissions of gas i from tools running process type p using input gas  i.
Ei,q = Emissions of gas i from tools running process type q using input gas i.
ni,p,a = Number of tools that use gas i, that run process type p, and that are equipped with abatement systems for gas i (site-specific).
mi,q.a = Number of tools that use gas i, that run process type q, and that are equipped with abatement systems for gas i (site-specific).
ni,p = Total number of tools using gas i and running process type p (site-specific).
     mi,q = Total number of tools using gas i and running process type q (site-specific).
i = Input gas.
     p = Chamber cleaning process sub-type.
     q = Reference process type.  There is one process type q that consists of the combination of etching and/or wafer cleaning processes.

Dividing all terms in Equation 4.2a by  Ei,qmi,q yields the following expression:
ai=  pni,p,a  Ei,pni,p/ Ei,qmi,q+ mi,q,a pni,p Ei,pni,p/ Ei,qmi,q+mi,q		Eq. 4.2b
By substituting Ɣi,p for the   Ei,pni,p/  Ei,qmi,q  in equation 4.2b, you arrive at equation I-24c:
  ai,f=pγi,p∙ni,p,a+ mi,q,apγi,p∙ni,p + mi,q	Eq. 4.2c (same as I -24C)

Similarly, ak,i can be expressed as follows:

ak,i= pEk,i,p,a + Ek,i,q,ap Ek,i,p +Ek,i,q= pnk,i,p,a  Ek,i,pnk,i,p+mk,i,q,a  Ek,i,qmk,i,qpnk,i,p  Ek,i,pnk,i,p+mk,i,q  Ek,i,qmk,i,q  	Eq. 4.2d
    Where:
ak,i = Estimate of the fraction of by-product k formed from input gas i that is exhausted from process tools that are equipped with abatement systems for by-product k (site-specific fraction).
Ek,i,p,a = Pre-control emissions of gas k from tools running process type p using input gas i and that are equipped with abatement systems for gas k.
Ek,i,q,a = Pre-control Emissions of gas k from tools running process type q using input gas i and that are equipped with abatement systems for gas k.
Ek,i,p = Pre-control emissions of gas k from tools running process type p using input gas i.
Ek,i,q = Pre-control emissions of gas k from tools running process type q using input gas i.
nk,i,p,a = Number of tools that emit by-product k formed from input gas i, that run process type p, and that are equipped with abatement systems for by-product k (site-specific).
mk,i,q,a = Number of tools that emit by-product k formed from input gas i, that run process type q , and that are equipped with abatement systems for by-product k (site-specific).
nk,i,p = Total number of tools emitting by-product k formed from input gas i and running process type p (site-specific).
mk,i,q = Total number of tools emitting by-product k formed from input gas i and running process type q (site-specific).
i = Input gas
k = By-product gas.
     p = Chamber cleaning process sub-type.
     q = Reference process type.  There is one process type q that consists of the combination of etching and/or wafer cleaning processes.
Dividing all terms in Equation 4.2d by  Ek,i,qmk,i,q yields the following expression:
ai=  pnk,i,p,a  Ek,i,pnk,i,p/ Ek,i,qmk,i,q+ mk,i,q,a pnk,i,p Ek,i,pnk,i,p/ Ek,i,qmk,i,q+mk,i,q	Eq. 4.2e
By substituting Ɣk,i,p for the   Ek,i,pnk,i,p/  Ek,i,qmk,i,q  in equation, you arrive at equation I-24d:
ak,i,f=pγk,i,p∙nk,i,p,a+ mk,i,q,apγk,i,p∙nk,i,p + mk,i,q	Eq. 4.2f (same as I -24D)

Gamma weighting factors can be expressed as a function of the consumption of input gases and of the corresponding emissions factors for each process type, as shown in Equations 4.2g and 4.2h.
Gamma Weighting Factor for Input gas I
   γi,p=Ei,p/niEi,q/mi = [Ci,p∙1-Ui,p ]/ni,pCi,q∙1-Ui,q/mi,q 	Eq. 4.2g
    Where:
Ɣi,p = Default factor reflecting the ratio of uncontrolled emissions per tool of input gas i from tools running process type p to uncontrolled emissions per tool of input gas i from process tools running process type q (fraction).
Ei,p = Emissions of gas i from tools running process type p using input gas  i.
Ei,q = Emissions of gas i from tools running reference process type q from tools using input gas i.
ni,p = Total number of tools using gas i and process type p (site-specific).
     mi,q = Total number of tools using gas i and running reference process type q (site-specific).
Ci,p = Annual amount of input gas i consumed by the reporting facility for process type p (kg).
Ci,q = Annual amount of input gas i consumed by the reporting facility for process type q processes (kg).
Ui,p  = Utilization  rate of gas i (fraction destroyed or transformed in process) for process type p processes.
Ui,q  = Utilization rate of gas i (fraction destroyed or transformed in process) for reference process type q processes.
     p = Chamber cleaning process sub-type.
     q = Reference process type.  There is one process type q that consists of the combination of etching and/or wafer cleaning processes.

Gamma Weighting Factor for By-Product k
γk,i,p=BPEk,i,p/nk,i,pBPEk,i,q/nk,i,q=[Ci,p∙Bk,i,p ]/ni,pCi,q∙Bk,i,q/mi,q= γi,p *1-Ui,q1-Ui,p*Bk,i,pBk,i,q	Eq. 4.2h
--------------------------------------------------------------------------------

    Where:
Ɣk,i,p = Default factor reflecting the ratio of uncontrolled emissions per tool of by-product k from process tools using gas i and running process type p to uncontrolled emissions per tool of by-product k from process tools using gas i and running process type q (fraction).
BPEk,i,p = Emissions of by-product k from tools running process type p using input gas i.
BPEk,i,q = Emissions of by-product k from tools running reference process type q using input gas i.
ni,p = Total number of tools using gas i and process type p (site-specific).
mi,q = Total number of tools using gas i and running reference process type q (site-specific).Ci,p = Annual amount of input gas i consumed by the reporting facility for process type p (kg).
Ci,q = Annual amount of input gas i consumed by the reporting facility for process type q processes (kg).
Bk,i,p  = Emission factor for by-product k generated from input gas i for process type p processes (kg of by-product gas k created per kg of  gas i consumed).
     Bk,i,q  = Emission factor for by-product k generated from input gas i for reference process type q processes (kg of by-product gas k created per kg of  gas i consumed).

Default gamma factors were developed from the gamma values reported from a total of 15 facilities to the IPCC during the development of the 2019 Refinement, but it should be noted that, based on the consumption and gas use allocation patterns of each facility, only a subset of the total number of facilities was available to calculate the gamma values for each gas or by-product/process type combination. Nevertheless, the default gamma values are believed to be representative of industry consumption and emissions patterns.  γi,p  values were calculated by each facility using Equations 4.2g above and emissions estimates calculated using the Tier 2c default emissions factors in the 2019 Refinement. γi,p values were calculated from the γi,p values submitted by each facility by back-calculating the ratios of per-tool consumption of input gas i for each wafer size, process-type combination, and input gas  and multiplying by the ratio of by-product formation factors for the corresponding wafer size, process-type combination, input gas, and by-product, Bk,i,p/Bk,j,q as shown in Equation 4.2h. γi,p  were calculated using the proposed emission factors in Tables I-3 and I-4.  Note that for one of the γi,p factors for the 300-mm wafer size, γNF3,IPC+ITC, γi,p was based on data for both the IPC and in-situ-thermal cleaning (ITC) process types.  However, the γCF4,NF3,IPC+ITC factor was calculated using the 1-U and BEF factors for IPC only.  This approach was supported by an analysis that found that accounting for the influence of ITC had negligible impact on the by-product weighting factor due to the overall similarity of the NF3 input gas and BEF factors for the two process types and, more importantly, to the fact that consumption of NF3 for ITC is estimated to account for only about 1% of the total NF3 consumption by both ITC and IPC.
The emissions from ITC and IPC processes are approximated to be equal to the sum of emissions from in-situ thermal clean (ITC) and in-situ plasma clean (IPC) processes divided by the total number of tools running IPC and ITC processes. This approximation is based on the expected similar flow rates and default emission factors between ITC and IPC processes.
Table 4.2 provides the γi,p default values calculated as the simple average of the gamma values received from industry facilities. An estimate of the relative uncertainties of the gamma values at the 95% confidence level (calculated by doubling the relative standard deviation of each gamma value across all individual data points) is also provided. Depending on process types, gas, and wafer size, average values for γi,p ranged from 1.4 to 26.
                                   Table 4.2
          Characteristics of Gamma Factor (γi) Data for Input Gases
Input gas (γi) vs. byproduct (γk,i), and wafer size
CF4 (IPC or ITC)/ EWC
C2F6 IPC/EWC
c-C4F8 IPC/EWC
NF3 (IPC or ITC)/ EWC
SF6 IPC/EWC
NF3 RPC/EWC
CF4 RPC/ EWC
C3F8 RPC/EWC
                             <= 200 mm wafer size
Average γi,p
 13†
 9.3
 4.7
 2.9†
 11
 1.4
 NM
 NM
Average γCF4,i,p
 NA
 23
 6.7
 110
 8.7
 36
 NM
 NA
Average γC2F6,i,p
 NA
 NA
 NA
 NA
 3.4
 NA
 NA
 NA
No. of Facilities
 6
 5
 2
 7
 3
 6
 NA
 NA
Relative uncertainties
 240%
 260%
 ꞎ
 160%
 340%
 160%
 NA
 NA
                               300 mm wafer size
Average γi,p
 NM
 NM
 NM
 26†
 NM
 10
 NM
 NM
Average γCF4,i,p
 NA
 NA
 NA
 17
 NA
 80
 NA
 NA
Average γCHF3,i,p
 NA
 NA
 NA
 NA
 NA
 0.24
 NA
 NA
Average γCHF2F2,i,p
 NA
 NA
 NA
 NA
 NA
 111
 NA
 NA
Average γCH3F,i,p
 NA
 NA
 NA
 NA
 NA
 33
 NA
 NA
No. of Facilities
 NA
 NA
 NA
 10
 NA
 10
 NA
 NA
Relative uncertainties
 NA
 NA
 NA
 280%
 NA
 320%
 NA
 NA
Source: Survey of industrial facility data conducted by the authors of Chapter 6 of the 2019 Refinement.
*Gamma weighting factors for semiconductor manufacturing may be applied to MEMS manufacturing processes that are carried out using tools and processes similar to those used to manufacture semiconductors (for further details see discussion in the Choice of method section, in particular footnote 3).
† The gamma values for (IPC or ITC)/EWC for 200 mm were developed based on IPC only and the values for 300 mm were developed based on the total emissions and tool count from ITC and IPC. γi,p is assigned based on analogy due to similar emission factors for IPC and ITC, where known, for the same gas and wafer size.
ꞎ Insufficient data to calculate
NM = Not measured, NA = Not applicable

γk,i,p values were calculated for each wafer size, process-type combination, input gas, and by-product by back-calculating consumption gammas for each wafer size, process-type combination, and input gas from the γi,p data received from industry using equation 4.2d and the 2019 Refinement emission factors used by industry to complete their submissions and adjusted to align with the proposed emissions factors for Tables I-3 and I-4 including calculating gamma values for newly identified by-products.
In Table I-18 of the proposed rule, where data existed for one combination of clean and etch process types (e.g. IPC/EWC) but not the other (e.g. (IPC+ITC)/EWC), γi,p was assigned by analogy to the process type combination where data was available.  This was considered a reasonable approximation due to the similarities in emission factors between IPC and ITC.
For Table I-18, the gamma values calculated for fabs that manufacture both 200 mm and 300 mm wafers (also shown in Table 4.3 below), the proposed gamma values were generally developed for each combination of input gas, process types, and (if applicable) by-product gas by taking the average of the gamma values across the two wafer sizes. However, in some cases, gamma values were not available for both wafer sizes for a combination of input gas, process types, and/or by-product gas. In cases where there was no gamma value for a particular combination of input gas and process types for one wafer size but one existed for the other wafer size, the existing gamma value was used for fabs that manufacture both wafer sizes.  In cases where a gamma value for a particular combination of input gas and process types existed for the input gas but not all by-products for both wafer sizes the existing gamma value was used for fabs that manufacture both wafer sizes.

                                   Table 4.3
          Characteristics of Gamma Factor (γi) Data for Input Gases
Input gas (γi) vs. byproduct (γk,i), and wafer size
CF4 (IPC or ITC)/ EWC
C2F6 IPC/EWC
c-C4F8 IPC/EWC
NF3 (IPC or ITC)/ EWC
SF6 IPC/EWC
NF3 RPC/EWC
CF4 RPC/ EWC
C3F8 RPC/EWC
 If manufacturing wafer sizes <=200 mm AND manufacturing 300 mm (or greater) wafer sizes
i
 13
 9.3
 4.7
 14
 11
 NA
 NA
 5.7
CF4,i
 NA
 23
 6.7
 63
 8.7
 NA
 NA
 58
C2F6,i
 NA
 NA
 NA
 NA
 3.4
 NA
 NA
 NA
CHF3,i
 NA
 NA
 NA
 NA
 NA
 NA
 NA
 0.24
CH2F2,i
 NA
 NA
 NA
 NA
 NA
 NA
 NA
 110
CH3F,i
 NA
 NA
 NA
 NA
 NA
 NA
 NA
 33

Revisions to improve by-Product estimates
Finally, we are proposing to replace Equation I-19 with a set of equations (i.e., Equations I-19A, I-19B, and I-19C) that will more accurately account for emissions when pre-control emissions of an F-GHG come close to or exceed the consumption of that F-GHG during the stack testing period.  Pre-control emissions of an F-GHG can approach or exceed consumption of that F-GHG when the F-GHG is generated as a by-product of other F-GHGs used in the fab. As discussed in Section 2.2, nearly all processes produce CF4 as a by-product.  To ensure that calculated emission factors reflect this physical reality, any excess pre-control emissions of the F-GHG should be assumed to be formed as a by-product. Currently, the paragraph containing Equation I-19, 40 CFR 98.93(i)(3)(iii), does not sufficiently account for such by-product formation, potentially resulting in overestimated input gas emission factors and underestimated by-product gas emission factors. This potential inaccuracy arises because 40 CFR 98.93(i)(3)(iii), in its assignment of portions of the emissions to either input gases or by-products, does not currently account for the utilization (dissociation) of the input gas or for any abatement of the input gas. Instead, the provision compares the total measured emissions of the F-GHG, which may have passed through abatement systems prior to measurement, to the consumption (termed "activity" in Equation I-19) of that F-GHG during the stack testing period. If the measured emissions equal or exceed consumption, the term for total emissions in Equation I-19, ∑sEi,s, is equated to consumption to calculate the input gas emission factor, and any difference between the measured emissions of the F-GHG and the consumption of the F-GHG is treated as by-product emissions and used to calculate a by-product emission factor (BEF) in Equation I-20. While this approach avoids assigning a controlled emission factor greater than 1.0 to the input gas, in cases where the measured emissions are greater than consumption, the corresponding pre-control emission factor is either equal to 1.0 (if the measured emissions are uncontrolled) or greater than 1.0 (if the measured emissions are controlled). In the first case, the pre-control emission factor fails to account for any utilization of the input gas. In the second case, the pre-control emission factor both fails to account for any utilization of the input gas and attributes emissions to the input gas for which the input gas cannot possibly be the source (because that would violate conservation of mass).

To more accurately assign emissions of the gas to by-product or input gas emissions, a better methodology is to compare the measured emissions to the maximum expected controlled emissions of the input gas during the stack testing period, rather than to the consumption during that period. To make this change, we are proposing to remove Equation I-19 and replace that equation with Equations I-19A, I-19B, and I-19C, making corresponding changes to 40 CFR 98.93(i)(3)(iii). Equation I-19A estimates the maximum expected controlled emissions for each F-GHG from the fab during the stack testing period at a utilization rate (U) equal to 0.2 (i.e., a 1-U or input gas emission factor of 0.8) and at the levels of abatement and abatement system uptime observed during the stack testing period. If the total emissions measured during the stack testing period are less than the maximum expected controlled emissions calculated using I-19A, then all emissions of gas i are attributed to the consumption of gas "i" and Equation I-19B is used to calculate the input gas emission factor for gas "i". Equation I-19B is similar to Equation I-19 in the current rule, but with an updated process-independent variable for the DRE. However, if the total measured emissions are greater than the estimate of the maximum controlled emissions, then the input gas emission factor is assumed to be equal to the maximum controlled emission rate at an uptime equal to 1, as calculated in Equation I-19C. The remaining emissions (the difference between the measured emissions and the value calculated in equation I-19A) are used to calculate the BEF for that gas from other input gases in Equation I-20.

The revised equations improve upon the current equations because they account both for any control of the emissions and for some utilization of the input gas. The input gas emission factor (1-U) of 0.8 used in Equations I-19A and I-19C is the same as the default 1-U factor that would be assigned where a default is not available in the proposed Tables I-3 and I-4.  Using a value of 0.8 as a maximum input gas emission factor (1-U) would be consistent with the other proposed changes and is expected to increase the accuracy of the stack testing method, as some utilization of the input gas is expected. These changes to the stack testing equations would improve the quality of the stack testing method by more accurately assigning emissions to their source.

References
Updated 2017 SIA Member Triennial Report, Appendix A.  Submitted to the U.S. EPA Greenhouse Gas Reporting Program (GHGRP), Subpart I: Electronics Manufacturing. May 10, 2018.
International SEMATECH Manufacturing Initiative Environmental Safety and Health Technology Center Etch Process Equipment Emissions Characterization Data. February 6, 2012. Available in U.S. EPA docket EPA-HQ-OAR-2011-0028.
Tier 2a NF3 and C2F6 Emission Factor Calculations.  November 8, 2012.  Available under U.S. EPA docket ID: EPA-HQ-OAR-2011-0028-90.
EPA (2018) Envirofacts. Greenhouse Gas Reporting Program (GHGRP), Subpart I: Electronics Manufacturing. Available online at: <http://www.epa.gov/enviro/facts/ghg/search.html>. Accessed in October 2018.
SEMI - Semiconductor Equipment and Materials Industry (2016) World Fab Forecast, May 2017 Edition.

APPENDIX
Additional Scenarios for Emission Factor Calculation Methods

This section presents and discusses the accuracy of each emission factor calculation method under five additional scenarios. These scenarios were selected to test the methods under a variety of conditions, especially conditions where one or more of the methods might be expected to perform poorly. The scenarios include three using CF4 and CHF3 as the input gases and two using CHF3 and CH2F2 as the input gases.
Scenarios using CF4 and CHF3 as the input gases:
 A case where the posited 1-U for CF4 = 0.5 x the reference 1-U and the posited BEF for CF4 from CHF3 = 0.5 x reference BEF
 A case where the posited 1-U for CF4 = 1.4 x the reference 1-U and the posited BEF for CF4 from CHF3 = 0.5 x reference BEF
 A case where the posited 1-U for CF4 = 0.5 x the reference 1-U and the posited BEF for CF4 from CHF3 = 2 x reference BEF
For ease of reference, Table A.1 shows the reference 1-U and BEF values for CF4 and CHF3 for 300-mm wafers.
  Table A.1: Reference 1-U and BEF values for CF4 and CHF3 for 300-mm wafers
Input Gas
 1-U
BCF4
BCHF3
CF4
0.68

0.01
CHF3
0.35
0.07

Figure A.1: CF4 1-U and BEF values as a function of shares of CF4 and CHF3 input gases by method (Assumes constant EFs and BEFs, the 1-U for CF4 is 0.5 x the reference value and the BEF for CF4 from CHF3 is 0.5 x the reference value)

Both the posited 1-U value and the posited BEF value are half as large as their corresponding reference values in this scenario, which might lead us to expect the Reference Emission Factor Method to perform poorly. However, the 1-U and BEF values yielded by the Reference Emission Factor Method precisely estimate the posited 1-U and BEF values in this case. This is because the posited 1-U and BEF are both the same fraction of the reference 1-U and BEF, respectively (0.5), and therefore the scaling factor applied to the reference values equals the same fraction (0.5). Otherwise, the behavior of the methods in this scenario is similar to the behavior they exhibit in the scenario featured in Figure 2.1 (1-U = 0.75 x reference 1-U; BEF = reference BEF). The All-Input-Gas and Modified All-Input-Gas Methods underestimate the CF4 BEF and overestimate the CF4 1-U, with the overestimate rising hyperbolically as the fraction of CF4 in the input gas mass decreases. (In this case, the calculated 1-U factor never exceeds 0.8 in the range of CF4/CHF3 proportions shown, so the results for the Modified All-Input-Gas Method are identical to those for the unmodified version of the method.) Finally, the Multi-gas Method yields 1-U and BEF values that rise together from the posited BEF value (when CF4 makes up a small proportion of the mass of the input gases) to the posited 1-U value (when CF4 makes up a large proportion of the mass of the input gases).

Figure A.2: CF4 1-U and BEF values as a function of shares of CF4 and CHF3 input gases by method (Assumes constant EFs and BEFs, the 1-U for CF4 is 1.4 x the reference value and the BEF for CF4 from CHF3 is 0.5 x the reference value)

This scenario represents a significant test for the Reference Emission Factor Method because it posits a 1-U that is larger than the reference 1-U and a BEF that is smaller than the reference BEF. This means that the scaling factor will be smaller than the correct ratio between the posited 1-U and the reference 1-U and larger than the correct ratio between the posited BEF and the reference BEF. Despite this challenge, the Reference Emission Factor Method performs as well as or better than the other methods. Because the posited 1-U value is close to 1 (0.95) in this scenario, the All-Input-Gas Method yields 1-U values over 1 as soon as the share of CF4 in the mass of input gas drops below half. For the same reason, the Modified All-Input-Gas Method consistently yields a 1-U of 0.8, and it also yields a hyperbolically growing BEF as the share of CF4 in the mass of input gas grows and the share of CHF3 in the mass of input gas declines. As in the other scenarios, the Multi-gas Method yields 1-U and BEF values that rise together from the posited BEF value to the posited 1-U value. In this case, this leads to large errors in the calculated 1-U and BEF values because the posited 1-U and BEF values are relatively far apart.

Figure A.3: CF4 1-U and BEF values as a function of shares of CF4 and CHF3 input gases by method (Assumes constant EFs and BEFs, the 1-U for CF4 is 0.5 x the reference value and the BEF for CF4 from CHF3 is 2 x the reference value)

This scenario represents a still more challenging test for the Reference Emission Factor Method as well as for the All-Input-Gas Method. The scenario again posits 1-U and BEF values that have very different relationships to their respective reference values, but in this case, the posited 1-U value is smaller than the reference 1-U value while the posited BEF value is larger than the reference BEF value. The Reference Emission Factor Method yields a 1-U value that is significantly (about 2.5x) higher than the posited 1-U when CF4 makes up a small share of the input gas mass, although the estimate becomes more accurate as the CF4 share increases. The method yields a BEF that is 40 to 75 percent lower than the posited BEF as the CF4 share increases. Nevertheless, the Reference Emission Factor Method 1-U value is more accurate than the 1-U value yielded by either the All-Input-Gas Method or the Modified All-Input-Gas Method for most CF4/CHF3 proportions, and the same is true of the BEF. The Multi-gas Method again yields 1-U and BEF values that rise together from the posited BEF value to the posited 1-U value. Because the posited 1-U and BEF values are relatively close together in this scenario, the resulting errors are smaller than in other scenarios, but the maximum error is still a factor of approximately 2.3 (the ratio between the posited 1-U value and the posited BEF value).
To examine the impact of using different input gases, we repeat the last two scenarios using CHF3 and CH2F2 as the input gases, focusing on emissions of CHF3.
Scenarios using CHF3 and CH2F2 as the input gases:
 A case where the posited 1-U for CHF3 = 1.4 x reference 1-U and the posited BEF for CHF3 from CH2F2 = 0.5 x reference BEF
 A case where the posited 1-U for CHF3 = 0.5 x reference 1-U and the posited BEF for CHF3 from CH2F2 = 2 x reference BEF
For ease of reference, Table A.2 shows the reference emission factors for CHF3 and CH2F2:
 Table A.2: Reference 1-U and BEF values for CHF3 and CH2F2 for 300-mm wafers
Input Gas
 1-U
BCHF3
BCH2F2
CHF3
0.35

0.003
CH2F2
0.15
0.03

Figure A.4: CHF3 1-U and BEF values as a function of shares of CHF3 and CH2F2 input gases by method (Assumes constant EFs and BEFs, the 1-U for CHF3 is 1.4 x the reference value and the BEF for CHF3 from CH2F2 is 0.5 x the reference value)

The patterns seen above are similar to those seen in the analogous case for CF4 and CHF3 (Figure A.2), but there are some key differences. Because the reference 1-U and BEF values for CHF3 are smaller than the corresponding reference values for CF4, the 1-U value calculated by the All-Input-Gas Method never exceeds 1 and therefore never implies that mass is not conserved. In fact, the 1-U value remains below 0.8 and is therefore always the same (for the range shown) as the 1-U value calculated using the Modified All-Input-Gas Method. Consequently, the BEF calculated using the Modified All-Input-Gas Method is always zero rather than rising hyperbolically as in Figure A.2. Note that the pattern seen in Figure A.2 can be duplicated using CHF3 and CH2F2 if the posited 1-U value is selected to be a larger multiple of the reference 1-U value (e.g., 2.5x). However, such a large difference between the actual 1-U value and the reference 1-U value is presumably less likely than a more modest difference.
Figure A.5: CHF3 1-U and BEF values as a function of shares of CHF3 and CH2F2 input gases by method (Assumes constant EFs and BEFs, the 1-U for CHF3 is 0.5 x the reference value and the BEF for CHF3 from CH2F2 is 2 x the reference value)

Again, the patterns seen above are similar to those seen in the analogous case for CF4 and CHF3 (Figure A.3), with some key differences. As in Figure A.4, the 1-U value calculated by the All-Input-Gas Method never exceeds 1 and therefore never implies that mass is not conserved. Similarly, the 1-U value remains below 0.8 and is therefore always the same (for the range shown) as the 1-U value calculated using the Modified All-Input-Gas Method. Nevertheless, the All-Input-Gas Method and Modified-All-Input-Gas Method overestimate the 1-U significantly when CHF3 makes up less than half of the input mass, in addition to equating the BEF to zero. The Reference Emission Factor Method overestimates the 1-U by a smaller fraction. In general, the errors of both the Reference Emission Factor Method and the Multi-Gas Method are similar to those shown in Figure A.3.

Emission Factor Tables
Average Emission Factors for Gas Utilization Rates (1 - Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm Wafer Sizes: Corrected 2013 Dataset

                                 Process Gas i

                                      CF4
                                     C2F6
                                     CHF3
                                     CH2F2
                                     CH3F
                                     C3F8
                                     C4F8
                                      NF3
                                      SF6
                                     C4F6
                                     C5F8
                                     C4F8O
                                    Etching
                                     1-Ui
                                                                           0.66
                                                                           0.80
                                                                           0.42
                                                                           0.21
                                                                           0.33
                                                                           0.30
                                                                           0.19
                                                                           0.15
                                                                           0.32
                                                                           0.15
                                                                           0.10

                                     BCF4

                                                                           0.21
                                                                          0.074
                                                                           0.05
                                                                           0.04
                                                                           0.21
                                                                           0.05
                                                                           0.05
                                                                           0.04
                                                                           0.06
                                                                           0.11

                                     BC2F6
                                                                          0.080

                                                                          0.063
                                                                          0.052
                                                                          0.001
                                                                          0.183
                                                                          0.031
                                                                          0.045
                                                                          0.044
                                                                          0.074
                                                                          0.083

                                     BC4F6

                                                                        0.00010

                                                                          0.018

                                     BC4F8
                                                                          0.001

                                                                         0.0008

                                     BC3F8

                                                                        0.00012

                                     BC5F8

                                     BCHF3
                                                                          0.011

                                                                          0.050
                                                                          0.006
                                                                          0.012
                                                                          0.027
                                                                          0.025
                                                                          0.004
                                                                          0.019
                                                                          0.007

                                    BCH2F2

                                                                          0.004

                                                                          0.002

                                                                          0.002
                                                                          0.001
                                                                        0.00003
                                                                        0.00003

                                     BCH3F
                                                                          0.008

                                                                          0.008
                                                                          0.008

                                                                          0.001

                                                                          0.008

                               CHAMBER CLEANING
                            In situ plasma cleaning
                                     1-Ui

                                                                          0.225

                                     BCF4

                                                                          0.037

                                     BC2F6

                                     BC3F8

                            Remote plasma cleaning
                                     1-Ui

                                                                          0.063

                                                                          0.018

                                     BCF4

                                                                          0.050

                                     BC2F6

                                     BC3F8

                           In situ thermal cleaning
                                     1-Ui

                                                                          0.280

                                     BCF4

                                                                          0.010

                                     BC2F6

                                     BC3F8

Average Emission Factors for Gas Utilization Rates (1 - Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm Wafer Sizes: 2017 and 2020 Technology Assessment Reports
                                 Process Gas i

                                      CF4
                                     C2F6
                                     CHF3
                                     CH2F2
                                     C2HF5
                                     CH3F
                                     C3F8
                                     C4F8
                                      NF3
                                      SF6
                                     C4F6
                                     C5F8
                                    Etching
                                     1-Ui
                                                                           0.61

                                                                           0.18
                                                                           0.16

                                                                           0.23

                                                                           0.14
                                                                          0.176
                                                                          0.269
                                                                           0.03

                                     BCF4

                                                                          0.082
                                                                          0.090

                                                                          0.013

                                                                          0.044
                                                                          0.000
                                                                          0.006
                                                                          0.056

                                     BC2F6
                                                                          0.027

                                                                          0.051
                                                                          0.031

                                                                          0.014

                                                                          0.020

                                                                          0.003
                                                                          0.023

                                     BC4F6
                                                                         0.0083

                                                                         0.0162

                                                                         0.0012

                                                                         0.0022

                                     BC4F8
                                                                         0.0059

                                                                         0.0034
                                                                         0.0540

                                                                         0.0070

                                                                         0.0051

                                     BC3F8

                                     BC5F8

                                     BCHF3
                                                                          0.014

                                                                          0.070

                                                                          0.024

                                                                          0.034
                                                                         0.0001
                                                                          0.005
                                                                          0.009

                                    BCH2F2
                                                                          0.005

                                                                          0.002

                                                                          0.008

                                                                          0.003
                                                                         0.0003
                                                                          0.000

                                     BCH3F
                                                                         0.0060

                                                                         0.0283
                                                                         0.0014

                                                                         0.0063

                                                                         0.0082
                                                                         0.0006

                               CHAMBER CLEANING
                            In situ plasma cleaning
                                     1-Ui

                                                                           0.04

                                     BCF4

                                     BC2F6

                                     BC3F8

                            Remote plasma cleaning
                                     1-Ui

                                                                          0.018

                                     BCF4

                                                                          0.010

                                     BC2F6

                                     BC3F8

                                     BCHF3

0.000059

                                    BCH2F2

                                                                        0.00088

                                     BCH3F

                                                                         0.0028

                           In situ thermal cleaning
                                     1-Ui

                                     BCF4

                                     BC2F6

                                     BC3F8

Default Emission Factors for Gas Utilization Rates (1 - Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm Wafer Sizes: Proposed
                                 Process Gas i

                                      CF4
                                     C2F6
                                     CHF3
                                     CH2F2
                                     C2HF5
                                     CH3F
                                     C3F8
                                     C4F8
                                      NF3
                                      SF6
                                     C4F6
                                     C5F8
                                    Etching
                                     1-Ui
                                                                           0.65
                                                                           0.80
                                                                           0.37
                                                                           0.20

                                                                          0.300
                                                                           0.30
                                                                           0.18
                                                                          0.163
                                                                          0.295
                                                                           0.15
                                                                           0.10
                                     BCF4

                                                                           0.21
                                                                          0.076
                                                                          0.060

                                                                          0.029
                                                                           0.21
                                                                          0.045
                                                                          0.044
                                                                          0.033
                                                                          0.059
                                                                           0.11
                                     BC2F6
                                                                          0.058

                                                                          0.058
                                                                          0.043

                                                                          0.009
                                                                           0.18
                                                                          0.027
                                                                          0.045
                                                                          0.041
                                                                          0.062
                                                                          0.083
                                     BC4F6
                                                                         0.0083

                                                                          0.012

                                                                         0.0012

                                                                         0.0084

                                     BC4F8
                                                                         0.0046

                                                                         0.0027
                                                                          0.054

                                                                         0.0070

                                                                         0.0051

                                     BC3F8

                                                                        0.00012
                                     BC5F8

                                     BCHF3
                                                                          0.012

                                                                          0.057

                                                                          0.016
                                                                          0.012
                                                                          0.028
                                                                          0.023
                                                                         0.0039
                                                                          0.017
                                                                         0.0069
                                    BCH2F2
                                                                          0.005

                                                                         0.0024

                                                                         0.0033

                                                                         0.0021
                                                                        0.00074
                                                                       0.000020
                                                                       0.000030

                                     BCH3F
                                                                         0.0061

                                                                          0.027
                                                                         0.0036

                                                                        0.00073
                                                                         0.0063
                                                                         0.0080
                                                                         0.0082
                                                                        0.00065

                               CHAMBER CLEANING
                            In situ plasma cleaning
                                     1-Ui

                                                                          0.205

                                     BCF4

                                                                          0.037

                                     BC2F6

                                     BC3F8

                            Remote plasma cleaning
                                     1-Ui

                                                                          0.063

                                                                          0.018

                                     BCF4

                                                                          0.037

                                     BC2F6

                                     BC3F8

                                     BCHF3

                                                                       0.000059

                                    BCH2F2

                                                                        0.00088

                                     BCH3F

                                                                         0.0028

                           In situ thermal cleaning
                                     1-Ui

                                                                           0.28

                                     BCF4

                                                                          0.010

                                     BC2F6

                                     BC3F8


[Federal Register: June 11, 2008 (Volume 73, Number 113)]
[Notices]
[Page 33120]
[DOCID:fr11jn08-102]

=======================================================================
-----------------------------------------------------------------------

SECURITIES AND EXCHANGE COMMISSION

[Release Nos. 33-8927, 34-57929; File No. 4-559]

International Roundtable on Interactive Data for Public Financial
Reporting

AGENCY: Securities and Exchange Commission.

ACTION: Notice of roundtable meeting; request for comment.

-----------------------------------------------------------------------

SUMMARY: On Tuesday, June 10, 2008, the Securities and Exchange
Commission will hold a roundtable discussion on the experience in
countries that have already adopted interactive data; the views of
countries currently considering adopting interactive data; and the
perspectives from analysts and users of financial information about how
best to take advantage of the capabilities of interactive data. The
event begins with remarks by SEC Chairman Christopher Cox on the use of
interactive data by public companies and mutual funds to improve
disclosure for individual investors. Following Chairman Cox's remarks,
a panel discussion will consider the use of interactive data for public
financial reporting. Panelists will include representatives from
foreign securities regulators that already require interactive-data
reporting as well as representatives from foreign securities regulators
that are considering adopting a form of interactive-data disclosure. In
addition, the panel will feature users of such disclosure and solicit
their views on the use of interactive data for public financial
reporting. The panel will be moderated by Chicago Sun-Times personal
finance columnist Terry Savage.
    The roundtable will take place at the Commission's headquarters at
100 F Street, NE., Auditorium, Room L-002, Washington, DC, from 9:30
a.m. to 12 p.m. The public is invited to observe the roundtable
discussions. Seating is available on a first-come, first-serve basis.
The roundtable discussions also will be available via webcast on the
Commission's Web site at http://www.sec.gov. The Roundtable Agenda and
other materials related to the Roundtable, including written statements
submitted by participants for public distribution, will be accessible
at http://www.sec.gov/spotlight/xbrl/xbrl-meetings.shtml.

DATES: Comments should be received on or before August 1, 2008.

ADDRESSES: Comments may be submitted by any of the following methods:

Electronic Comments

     Use the Commission's Internet comment form (http://
www.sec.gov/rules/proposed.shtml); or
     Send an e-mail to<EMAIL_ADDRESS>Please include
File Number
     S7-11-08 on the subject line.

Paper Comments

     Send paper comments in triplicate to Secretary, Securities
and Exchange Commission, 100 F Street, NE., Washington, DC 20549-1090.

All submissions should refer to File Number S7-11-08. This file number
should be included on the subject line if e-mail is used. To help us
process and review your comments more efficiently, please use only one
method. The Commission will post all comments on the Commission's
Internet Web site (http://www.sec.gov/rules/proposed.shtml). Comments
are also available for public inspection and copying in the
Commission's Public Reference Room, 100 F Street, NE., Washington, DC
20549, on official business days between the hours of 10 a.m. and 3
p.m. All comments received will be posted without change; we do not
edit personal identifying information from submissions. You should
submit only information that you wish to make available publicly.

FOR FURTHER INFORMATION CONTACT: J. Troy Beatty, Senior Counsel, Office
of International Affairs at<PHONE_NUMBER>.

SUPPLEMENTARY INFORMATION: The Roundtable follows the issuance on May
30, 2008 of a proposed rule on Interactive Data to Improve Financial
Reporting. The proposed rule may be accessed on the Commission's Web
site (http://www.sec.gov/rules/proposed/2008/33-8924.pdf). The
Commission welcomes feedback regarding the proposed rule and any of the
topics to be addressed at the Roundtable, including those raised in the
questions below.

Questions for Panelists

     How did your interactive data program originate? Was it
driven by investors, the regulator, or some other organization? What is
the current status of your interactive data program?
     What is the scope of interactive filings required in your
jurisdiction? If none, what filings are currently being considered that
might be subject to an interactive data reporting requirement?
     What levels of detail of interactive data are you
considering or have been the most effective in implementing? What
issues arose in assessing the level of detail to be tagged in required
filings? In what manner were these issues resolved? Were the primary
considerations in addressing these issues based on technological or
regulatory developments?
     How did issuers in your jurisdiction respond, or how do
you anticipate they will respond, to the requirement to provide reports
using interactive data for financial reporting? Does your response
differ depending on the size of the issuer or the level of detail
required to be submitted?
     Did the use of interactive data in your jurisdiction
impact what or how issuers report financial information? Does
interactive data filing pose a burden to filers?
     What factors have most impacted the timing and ability of
issuers to move to the use of interactive data for financial reporting
in your jurisdiction?
     Do you find, or do you anticipate, that issuer filings in
interactive data in your jurisdiction benefit, or will benefit, the
investor and the larger investment community? What have been your
experiences to date in realizing these benefits? In what ways are
investors assessing and using interactive data? Are any alternatives
for easier access for investors being considered to increase usage of
the data?
     What regulatory filings would benefit investors by being
subject to an interactive data filing requirement? Are there portions
of existing filings that would benefit investors by being subject to an
interactive data filing requirement?
     In your experience, what ``works'' in terms of designing
and implementing interactive data regulatory requirements?
     Should interactive data filing tags be interoperable
across national markets? If so, what efforts could be made to make data
filing tags interoperable? Should regulatory authorities collaborate on
or encourage this?

    By the Commission.

    June 5, 2008.
Florence E. Harmon,
Acting Secretary.
 [FR Doc. E8-13053 Filed 6-10-08; 8:45 am]

BILLING CODE 8010-01-P


[Federal Register: October 2, 2008 (Volume 73, Number 192)]
[Notices]
[Page 57346-57347]
[DOCID:fr02oc08-55]

-----------------------------------------------------------------------

DEPARTMENT OF ENERGY

Federal Energy Regulatory Commission

 [Project No. 4306-017--Minnesota]

City of Hastings; Notice of Availability of Environmental
Assessment

September 26, 2008.
    In accordance with the National Environmental Policy Act of 1969,
as amended, and the Federal Energy Regulatory Commission's (Commission)
regulations (18 CFR Part 380), the Office of Energy Projects has
prepared an environmental assessment (EA) regarding the City of
Hastings' (City's) request to install two hydrokinetic turbines at the
Mississippi Lock and Dam No. 2 Hydroelectric Project. The project is
located on the Mississippi River in Dakota County, Minnesota. This EA
concludes that the Proposed Action, with staff's recommended mitigation
measures, would not constitute a major Federal action significantly
affecting the quality of the human environment.
    Copies of the EA are available for review in the Public Reference
Room of the Commission's offices at 888 First Street NE., Washington,
DC. The EA also may be viewed on the Commission's Internet Web site
(www.ferc.gov) using the ``eLibrary'' link. Enter the docket number
``P-4306''

in the docket number field to access the document. For assistance with
eLibrary, contact<EMAIL_ADDRESS>or call toll-free at (866)
208-3372, or for TTY contact<PHONE_NUMBER>.
    For further information regarding this notice, please contact
Andrea Claros at<PHONE_NUMBER> or by e-mail at<EMAIL_ADDRESS>
 Kimberly D. Bose,
Secretary.
 [FR Doc. E8-23215 Filed 10-1-08; 8:45 am]

BILLING CODE 6717-01-P