The invention relates to an aluminium OSF integrated circuit panel production method comprising surface preparation of two aluminium alloy sheets  deposition on one of the sheets of a weld-proof ink in reserved areas corresponding to the design of the circuit  connection by rolling of the sheets together  and expansion of the channels corresponding to the non-welded areas using a pressurised fluid  wherein one of the sheets is made of 1000 series alloy and the other of ah alloy containing iron and manganese and such that Fe + Mn > 0