aaron cordes
Senior Process Engineer at Crystal IS
senior process engineer crystal
experienced semiconductor process engineer demonstrated history working silicon chip fabrication 7nm r & high-volume manufacturing ; well wide-bandgap iii-v material . skilled scanning probe microscopy , crystal growth , x-ray diffraction , optical metrology , wafer slicing , grinding , chemical mechanical polish , failure analysis . strong operation professional doctor philosophy - phd focused nanoscale science & engineering suny polytechnic institute .
Crystal IS
https://www.linkedin.com/company/crystal-is
I manage substrate processing and metrology for high-volume wafer production.  This includes oversight of multi-wire saws, grinding, CMP, XRD, and various characterization processeses.  I work continuously to improve yield and address critical production issues.  I also maintain SQL database processes and data analysis for this process line; set up and monitor SPC, ensure measurement tools are in calibration; and regularly prepare and present reports on production line status.
Albany, New York Metropolitan Area
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Senior Process Engineer
Crystal IS
https://www.linkedin.com/company/crystal-is
Manage all internal and external metrology for manufacturing and R&D, while also engaging in process development projects to improve crystal growth quality and yield.
•	Oversee suite of metrology tools to monitor and improve crystal quality, including multiple X-ray, optical, and scanning probe techniques.
•	Managing introduction of new processing techniques for improved crystal growth performance and reduced labor costs.
•	Have qualified and introduced new in-line metrology techniques to improve crystal quality control.
Green Island, NY
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Senior Metrology Engineer
GLOBALFOUNDRIES
https://www.linkedin.com/company/globalfoundries
Developed measurements on automated Atomic Force Microscopy and optical overlay metrology toolsets for 7nm node chip development.
•	Oversaw introduction and evolution of new in-line AFM measurements, serving critical customer needs in through-Silicon Via development and defect review.
•	Improved performance of large fleet of automated optical microscopy tools through process and mark optimization, greatly increasing throughput at critical bottlenecks.
•	Coordinated daily with middle-of-line module engineers, recognizing and remedying emerging measurement, and processing control challenges at gate and contact layers.
Albany, New York Area
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Principal Engineer
RESEARCH FOUNDATION OF SUNY
https://www.linkedin.com/company/research-foundation-of-suny
Developed measurements and improved tool performance over numerous areas, including automated and laboratory AFM, spectroscopic ellipsometry, and defect inspection.
•	Characterized III-V materials using in-line and laboratory AFM, determining electrical impact and improving deposition performance.
•	Used defect inspection data to identify key defects, limiting line yield at electrical test.
•	Employed optical thickness tools, driving improved performance of novel etch technologies.
Albany, New York Area
Metrology Engineer
Sematech
https://www.linkedin.com/company/sematech
Managed diverse and rapidly changing research projects from leading-edge semiconductor manufacturers, including Intel, Samsung, and IBM.
•	Developed novel defect characterization capabilities utilizing PeakForce QNM, allowing in-situ classification of previously un-classifiable sub-1nm thick particle defects.
•	Managed FEI Titan3 TEM laboratory and sample prep equipment and implemented new formalized safety, training, and operations procedures, improving unit performance.
•	Fabricated 7nm device test structures using e-beam lithography and bench-top processing, allowing early metrology learning in key areas.
•	Presented key information and updated research results to senior staff members at major international conferences and large technical meetings.
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Metrology Engineer
Doctor of Philosophy - PhD
Nanoscale Science & Engineering
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SUNY Polytechnic Institute
https://www.linkedin.com/school/suny-polytechnic-institute/
MS
Experimental work in surface and interface physics.
Applied Physics
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The University of Texas at Austin
https://www.linkedin.com/school/theuniversityoftexasataustin-/
Bachelor of Science - BS
Physics
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The University of Texas at Austin
https://www.linkedin.com/school/theuniversityoftexasataustin-/
Bachelor of Arts - BA
Liberal Arts and Sciences, General Studies and Humanities
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The University of Texas at Austin
https://www.linkedin.com/school/theuniversityoftexasataustin-/
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SUNY Albany
https://www.linkedin.com/school/university-at-albany/
Semiconductor Defect Classification Utilizing Atomic Force Microscopy:  Mechanical Property and 3D Measurement Applications
ProQuest Dissertations Publishing
Quantitative nanomechanical measurement of electron beam surface modification
Proceedings of the SPIE
https://doi.org/10.1117/12.2190984
Analysis of InGaAs Defects by Conductive AFM
ISTFA 2014: Proceedings of the 40th International Symposium for Testing and Failure Analysis
https://www.asminternational.org/home/-/journal_content/56/10192/ZCP2014ISTFA193/CONFERENCE-PAPER
Profile variation impact on FIB cross-section metrology
Proceedings of the SPIE
https://doi.org/10.1117/12.917321
Sidewall slope sensitivity of critical dimension atomic force microscopy
Journal of Micro/Nanolithography, MEMS, and MOEMS
https://doi.org/10.1117/1.JMM.11.1.011011
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https://www.linkedin.com/in/vinayan-menon-91bb92
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https://www.linkedin.com/in/xintuo-dai-10212362
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https://www.linkedin.com/in/edison-chien-an-chen-32b26668
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https://www.linkedin.com/in/aaron-cordes-71656328
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https://www.linkedin.com/in/aaron-cordes-335355156
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https://nz.linkedin.com/in/aaron-cordes-45225222b
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