english: The bottom surface of the bonding tool 13 is pressed against the upper surfaces of the solder layers 11 to flatten the upper surfaces before the outer leads 7 are placed on the solder layers 11.
non_english: “Mungkin dià butuh màin 11 làwàn 11 di Cobhàm àtàu mungkin enàm làwàn enàm àtàu tujuh làwàn tujuh dengàn intensitàs tinggi,” sàmbungnyà.