[0182] It should be noted that there exist two main categories for the positioning of bond pads on an IC: (i) “peripheral” bond pads and; (ii) “non-peripheral” bond pads.
」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」＜第２章　物質の構成粒子＞（教p19-）