[0022] performing processing for partially reducing contact property between the first material layer and the second material layer; and
」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」」＜第２章　物質の構成粒子＞（教p19-）